Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Takenori Kakutani"'
Autor:
Sridhar Sivapurapu, Rui Chen, Kimiyuki Kanno, Takenori Kakutani, Martin Letz, Fuhan Liu, Suresh K. Sitaraman, Madhavan Swaminathan
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1465-1473
Autor:
Pulugurtha Markondeya Raj, Rao Tummala, Madhavan Swaminathan, Takenori Kakutani, Daichi Okamoto, Shreya Dwarakanath
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1552-1559
Downscaling of package wiring has been the singular focus to achieve higher logic-memory interconnect density to meet next-generation needs for high-bandwidth computing. This article presents, for the first time, a systematic modeling and experimenta
Autor:
Takenori Kakutani, Yuya Suzuki, Atom Watanabe, Mohanalingam Kathaperumal, Zhong Guan, Muhammad Ali, Serhat Erdogan, Madhavan Swaminathan
Publikováno v:
International Symposium on Microelectronics. 2020:000201-000205
This paper describes the demonstration of a low loss substrate (laminated glass) for high-frequency transmission using a dry film build-up material with low loss tangent (Df). This paper also evaluates filter characteristics and dielectric characteri
Autor:
Suresh K. Sitaraman, Martin Letz, Sridhar Sivapurapu, Mutee ur Rehman, Madhavan Swaminathan, Kimiyuki Kanno, Takenori Kakutani, Fuhan Liu, Rui Chen
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Glass has been shown to be a capable core substrate material for high frequency applications. In this paper we examine the capabilities of ultra-thin glass as a flexible material that can be used for high frequency flexible applications. The two stac
Autor:
Nobuhiro Ishikawa, Yuya Suzuki, Muhammad Ali, Toshiyuki Ogata, Mohanalingam Kathaperumal, Takenori Kakutani, Kota Oki, Shoko Mishima, Satoko Matsumura, Meiten Koh, Madhavan Swaminathan, Serhat Erdogan, Shoya Sekiguchi
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
This paper describes the development of a novel dry film-type dielectric material with low loss tangent (D f ) and the demonstration of a low-loss filter substrate using the dielectric material for high-frequency transmission applications. This paper
Autor:
Muhammad Ali, Mohanalingam Kathaperumal, Takenori Kakutani, Yuya Suzuki, Madhavan Swaminathan, Serhat Erdogan
Publikováno v:
2020 International Symposium on Semiconductor Manufacturing (ISSM).
With the tremendous advances and increasing demand in 5G communications, the low-loss performance of RF device components becomes more critical. Two parameters that have significant impact on the low-loss RF performance are lower circuit conductor lo
Autor:
Takenori Kakutani, Siddharth Ravichandran, Muhammad Ali, Rui Zhang, Rao Tummala, Atom Watanabe, P. Markondeya Raj, Madhavan Swaminathan
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Chip-embedded mm-wave antenna-integrated modules are demonstrated, for the first time, on panel-scale ultra-thin glass substrates, for high-speed 5G communication standards in the n257 band (26.5 – 29.5 GHz) defined by 3GPP. Co-packaging of amplifi
Autor:
Muhammad Ali, Daichi Okamoto, Zhong Guan, Atom Watanabe, Yuya Suzuki, Madhavan Swaminathan, Takenori Kakutani, Mohanalingam Kathaperumal
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this paper, we report an advanced low-loss dry film build-up material applicable to high-frequency transmission, and evaluation of filter characteristics and dielectric characteristics in the mmWave band. The wireless communication standard is evo
Autor:
Takenori Kakutani, Zhong Guan, Yuya Suzuki, Ali, Muhammad, Erdogan, Serhat, Watanabe, Atom, Kathaperumal, Mohanalingam, Swaminathan, Madhavan
Publikováno v:
Advancing Microelectronics; Sep/Oct2021, Vol. 48 Issue 5, p6-10, 5p