Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Takeharu Motobe"'
Autor:
Naoto Nagami, Tetsuya Enomoto, Daisaku Matsukawa, Takeharu Motobe, Nobuyuki Saito, Kohei Mizuno
Publikováno v:
International Symposium on Microelectronics. 2019:000042-000045
We have newly developed non photosensitive and photosensitive polyimide having excellent electrical/mechanical properties. At first we have re-designed the polymer backbone in order to obtain low Dk and Df performance. As a result, our new non photos
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6dbd16de38cbfa1e7a5a0391f16841bd
https://doi.org/10.4071/2380-4505-2019.1.000042
https://doi.org/10.4071/2380-4505-2019.1.000042
Autor:
Hiroko Yotsuyanagi, Daisaku Matsukawa, Tetsuya Enomoto, Takeharu Motobe, Noriyuki Yamazaki, Shiori Sakakibara
Publikováno v:
International Symposium on Microelectronics. 2018:000508-000511
Hitachi Chemical DuPont MicroSystems (HDMS) has been developing photo sensitive negative-tone polyimides (PIs) as dielectrics for re-distribution layers (RDLs) in wafer level packages (WLPs) and as protection layers in semiconductor ICs. Photo sensit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80f693d68610f4003e084e223a7d96aa
https://doi.org/10.4071/2380-4505-2018.1.000508
https://doi.org/10.4071/2380-4505-2018.1.000508
Publikováno v:
Journal of Photopolymer Science and Technology. 31:451-456
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b74a3702b3d614cf6362e0eb927e286c
https://doi.org/10.2494/photopolymer.31.451
https://doi.org/10.2494/photopolymer.31.451
Autor:
Tetsuya Enomoto, Takeharu Motobe, Noriyuki Yamazaki, Hiroko Yotsuyanagi, Daisaku Matsukawa, Shiori Sakakibara
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A novel polyimide (PI) with improved shrinkage and lithographic performance was developed by re-designing key components of the formulation. It should be noted that this PI, due to lower shrinkage during cure, can achieve a flatter surface as compare
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa3a89d824b8db12360715d01fc42aff
https://doi.org/10.1109/ectc.2019.00061
https://doi.org/10.1109/ectc.2019.00061
Autor:
Masato Nishimura, Daisaku Matsukawa, Tetsuya Enomoto, Masayuki Ohe, Nakamura Tadamitsu, Noriyuki Yamazaki, Takeharu Motobe
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-15
Photo-definable polyimides (PI) and polybenzoxazoles (PBO) have been widely used as dielectrics for re-distribution layers in wafer level chip size packages (WL-CSP). These materials can simplify the manufacturing process and ensure high reliability
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b16ee096ff0b7e9dca2609f5868fd7c9
https://doi.org/10.4071/2017dpc-poster_matsukawa
https://doi.org/10.4071/2017dpc-poster_matsukawa
Autor:
Tetsuya Enomoto, Nakamura Tadamitsu, Nobuyuki Saito, Daisaku Matsukawa, Masayuki Ohe, Takeharu Motobe, Abe Satoshi, Noriyuki Yamazaki
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
Hitachi Chemical DuPont MicroSystems (HDMS) has been developing photosensitive negative-tone polyimides (PI) and positive-tone poly(benzoxazole)s (PBO) for use as protection layers in semiconductor ICs or as dielectrics for re-distribution layers in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f0bf737e60dd746497a57382f367708
https://doi.org/10.23919/icep.2017.7939431
https://doi.org/10.23919/icep.2017.7939431
Autor:
Daisaku Matsukawa, Masayuki Ohe, Tetsuya Enomoto, Nakamura Tadamitsu, Masato Nishimura, Takeharu Motobe, Noriyuki Yamazaki
Publikováno v:
2016 IEEE CPMT Symposium Japan (ICSJ).
Photo-definable polyimides and polybenzoxazoles (PBO) have been widely used as dielectrics for re-distribution layers in wafer level chip size packages. These materials can simplify the manufacturing process and ensure high reliability owing to their
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a1f494485244ca2814f935154dda6d2
https://doi.org/10.1109/icsj.2016.7801258
https://doi.org/10.1109/icsj.2016.7801258
Autor:
Masayuki Ohe, Konno Taku, Nakamura Yuki, Ono Keishi, Tomonori Minegishi, Takeharu Motobe, Masashi Kotani
Publikováno v:
Journal of Photopolymer Science and Technology. 23:477-482
Polyimide (PI) and poly(benzoxazole) (PBO) materials are widely used as stress buffer and rewiring cover layers to improve the reliability of semiconductors. With recent advances in this area, the chemical resistance of PI and PBO to organic solvents
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a6f338c330fd73574c6dd4ecf17e3e7
https://doi.org/10.2494/photopolymer.23.477
https://doi.org/10.2494/photopolymer.23.477
Publikováno v:
2015 IEEE CPMT Symposium Japan (ICSJ).
Polyimides (PI) and polybenzoxazoles (PBO) have good heat resistance, mechanical properties and electrical insulation. Therefore, they have been widely used as buffer coating and interlayer dielectrics with protection property for electric applicatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc85a2c1091dafa3a53ed37b5076d191
https://doi.org/10.1109/icsj.2015.7357351
https://doi.org/10.1109/icsj.2015.7357351
Publikováno v:
ECS Meeting Abstracts. :700-700
In this paper, new polyimide coating technologies will be reported that are useful for next generation semiconductor applications. Traditionally, polyimide materials (PI) have been used as stress buffer and rewiring cover layers to improve semiconduc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::59e530e14d64787f62b2f5204d30b387
https://doi.org/10.1149/ma2007-01/14/700
https://doi.org/10.1149/ma2007-01/14/700