Zobrazeno 1 - 10
of 52
pro vyhledávání: '"Takayuki KITAJIMA"'
Autor:
Jumpei KUSUYAMA, Ayumu HONDA, Shintaro IWAHASHI, Takayuki KITAJIMA, Akinori YUI, Toshihiro ITO, Xiaodong LU, Alexander H. SLOCUM
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 83, Iss 852, Pp 17-00102-17-00102 (2017)
Si wafer diameter tends to be increased from 300 mm to 450 mm in order to increase semiconductor device productivity. To this end, the authors developed a rotary grinding machine with high stiffness, equipped with water hydrostatic bearings. This gri
Externí odkaz:
https://doaj.org/article/110200f9544746f494924e211bc75d0b
Autor:
Jumpei KUSUYAMA, Ayumu HONDA, Takayuki KITAJIMA, Go OKAHATA, Akinori YUI, Toshihiro ITO, A. H. SLOCUM
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 82, Iss 842, Pp 16-00190-16-00190 (2016)
Increasing of Si wafer diameter from φ300 mm to φ450 mm is required to enhance productivity of semiconductor devices. The authors developed a high stiff rotary grinding machine, which consists of a rotary table system and a wheel spindle system. Th
Externí odkaz:
https://doaj.org/article/6e8c8212acd3456f96963fec94eddea6
Publikováno v:
Materials Science Forum. 874:395-400
For the backgrinding of semiconductor devices, a rotary grinding process is indispensable for achieving the required wafer thickness. The relative velocity between the grinding wheel and the wafer is maximum at the periphery of the wafer and minimum
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::81c18d4343348d4e1e8a37aa5ab8d2da
https://doi.org/10.4028/www.scientific.net/msf.874.395
https://doi.org/10.4028/www.scientific.net/msf.874.395
Publikováno v:
Materials Science Forum. 874:487-491
Carbon-fiber-reinforced plastic (CFRP) is used in various industries such as aerospace and automobile industries because of its high mechanical characteristics. However, this material is difficult to cut. Tool wear and delamination frequently occur d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f63e75e79a9005b8d9bbb9a5470861d3
https://doi.org/10.4028/www.scientific.net/msf.874.487
https://doi.org/10.4028/www.scientific.net/msf.874.487
Autor:
Akinori Yui, Nagahisa Ogasawara, Hirotsugu Saito, Jumpei Kusuyama, Takayuki Kitajima, Shintaro Iwahashi, Alexander H. Slocum
Publikováno v:
Advanced Materials Research. 1136:655-660
Increasing the wafer diameter from φ300 mm to φ450 mm is required to enhance semiconductor devices productivity. A high-stiffness rotary grinding machine equipped with water hydrostatic bearings was developed for a φ450 mm silicon wafer. The grind
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed190d6cf576222f1e7b77d1c497c529
https://doi.org/10.4028/www.scientific.net/amr.1136.655
https://doi.org/10.4028/www.scientific.net/amr.1136.655
Publikováno v:
Advanced Materials Research. 1136:245-250
The use of hard and brittle materials for manufacturing optical parts, such as dies and molds are required in order to extend mold life. Although, cobalt-free tungsten carbide is one of the hardest materials, micro-cutting is very difficult due to it
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::491eaa3a27645629a9045dfd0aaa0417
https://doi.org/10.4028/www.scientific.net/amr.1136.245
https://doi.org/10.4028/www.scientific.net/amr.1136.245
Publikováno v:
Advanced Materials Research. 1017:181-186
Micro-machining of hard dies and molds for optical parts or precision instruments is required to extend die and mold life. This paper investigates the effect of cutting fluid on diamond tool life under micro V-groove turning of cobalt-free tungsten c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0ce4d9672931edbbc9f80eaee6a1edd
https://doi.org/10.4028/www.scientific.net/amr.1017.181
https://doi.org/10.4028/www.scientific.net/amr.1017.181
Autor:
Alexander H. Slocum, Akinori Yui, Go Okahata, Shigeki Okuyama, Hirotsugu Saito, Takayuki Kitajima
Publikováno v:
Advanced Materials Research. 1017:604-609
There is a compelling need for development of a surface grinding machine for 450mm diameter silicon-wafers. The authors have developed a new surface grinding machine for the large scale silicon-wafers. The machine has a rotary work table equipped wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b8e3c0aed02091508ee008d4fd75cc07
https://doi.org/10.4028/www.scientific.net/amr.1017.604
https://doi.org/10.4028/www.scientific.net/amr.1017.604
Publikováno v:
Advanced Materials Research. 1017:383-388
Carbon Fiber Reinforced Plastic (CFRP) is a high-strength and high-elastic-modulus composite material that is hardened by impregning carbon fiber with epoxy resin. Although, many sutdies of hole drilling of CFRP have been conducted, few sutdies of fa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65157ac5fdeb7908d72f16f74d5fda1a
https://doi.org/10.4028/www.scientific.net/amr.1017.383
https://doi.org/10.4028/www.scientific.net/amr.1017.383
Publikováno v:
Advanced Materials Research. 1017:411-414
Interest in carbon-fiber-reinforced plastic (CFRP) has been growing for the last several years. CFRP, a composite material made of carbon fibers and resins, has high mechanical characteristics and is well known as a difficult-to-cut material. During
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f223bda795ab90aa364497e81337a2c
https://doi.org/10.4028/www.scientific.net/amr.1017.411
https://doi.org/10.4028/www.scientific.net/amr.1017.411