Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Takayuki ATARASHI"'
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 80, Iss 811, Pp TEP0043-TEP0043 (2014)
Heat density of high-load electronics such as high-performance servers and the inverters used in vehicles has been increasing as the result of higher processing speeds and computational scale, and higher output, etc. We therefore investigated an air-
Externí odkaz:
https://doaj.org/article/c58e6b84dd544b668af7bfb383b5f693
Publikováno v:
Journal of Electronics Cooling and Thermal Control. :70-77
Forced-air convection cooling of high-power electronic devices is widely used, but it has a problem that a rise in temperature of the air used to cool the upstream devices decreases the cooling capa-bility for the downstream devices. In this study we
Publikováno v:
Journal of Electronic Packaging. 123:315-318
A numerical method for simulating impinging air flow and heat transfer in plate-fin type heat sinks has been developed. In this method, all the fins of an individual heat sink and the air between them are replaced with a single, uniform element havin
Publikováno v:
Journal of Electronic Packaging. 119:73-77
Steady state three-dimensional incompressible flow analysis based on the two-equation model of turbulence is performed. The finite element method employing the penalty function formulation by Hughes et al. (1979) is used. To reduce the computational
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 60:620-626
A high-performance air cooling system unifying the heated plates temperature distribution is investigated. The plates are arranged in series and cooled by serial air flow. As a result of the investigations, fins with projections and a multiflow air d
Publikováno v:
SAE Technical Paper Series.
Publikováno v:
The Proceedings of the Thermal Engineering Conference. 2004:361-362
Publikováno v:
Computational Mechanics ’95 ISBN: 9783642796562
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c11e1ceae70a6f4ede7ba122762ee1d1
https://doi.org/10.1007/978-3-642-79654-8_181
https://doi.org/10.1007/978-3-642-79654-8_181
Autor:
Takayuki Atarashi
Publikováno v:
Proceedings of thermal engineering conference. 2002:511-512