Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Takashi Nishimori"'
Autor:
Takashi Nishimori, Tatsuya Urata
Publikováno v:
Rigakuryoho Kagaku. 35:893-898
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f1bde4fe45c0e3b7619aacf01077783
https://doi.org/10.1589/rika.35.893
https://doi.org/10.1589/rika.35.893
Autor:
Takashi, NISHIMORI
Publikováno v:
社会認識教育学研究. 30:111-120
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=jairo_______::1b7c0846c53bc2cb197dcb21c3c1d7a2
http://id.nii.ac.jp/1624/00024692/
http://id.nii.ac.jp/1624/00024692/
Autor:
Akira Ito, Takashi Nishimori
Publikováno v:
Rigakuryoho Kagaku. 29:51-55
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed947afeac888b7fec2892d30f2dda3b
https://doi.org/10.1589/rika.29.51
https://doi.org/10.1589/rika.29.51
Autor:
Daisuke Nakamura, Toshinori Ogashiwa, Katsunao Tanaka, Hideyuki Fukushi, Takashi Nishimori, Shuji Tanaka, Masayoshi Esashi, Mamoru Mohri
Publikováno v:
Sensors and Actuators A: Physical. 188:198-202
An anodically bondable low temperature cofired ceramic (LTCC) wafer offers a versatile, clean and reliable wafer-level hermetic packaging for MEMS. This paper reports electrical interconnection in parallel with anodic bonding between MEMS on a Si waf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a5f290ca5f7fbea8c4477ecdfb76b4f
https://doi.org/10.1016/j.sna.2012.01.003
https://doi.org/10.1016/j.sna.2012.01.003
Autor:
Masahiko Mitsuhashi, Takashi Nishimori, Nobuyuki Akiyama, Isamu Taguchi, Shinohara Toshiro, Toshinori Ogashiwa, Masayasu Soga, Takeshi Ito
Publikováno v:
Microelectronics Reliability. 52:199-205
Metallization multilayers on the back side of a power device were focused in this study. Si wafers coated with high melting point metals were exposed at 300 °C for 300 h to investigate diffusion condition of the metallization layer. We developed and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8457091c6c174352872fc1db762b17b3
https://doi.org/10.1016/j.microrel.2011.07.094
https://doi.org/10.1016/j.microrel.2011.07.094
Autor:
Akira Ito, Takashi Nishimori
Publikováno v:
Journal of Physical Therapy Science. 23:883-887
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3afbb0286c1802932d11b59d38ef36ab
https://doi.org/10.1589/jpts.23.883
https://doi.org/10.1589/jpts.23.883
Autor:
Jun Mizuno, Toshinori Ogashiwa, Takuya Yazaki, Takashi Nishimori, Tatsuya Ikoma, Hiroyuki Kusamori, Hiroyuki Ishida
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 3:62-67
A study of wafer-level hermetic bonding using sub-micron gold particles with a mean diameter of 0.3 μm was conducted at bonding temperatures of 150–200°C with varying bonding pressures in the range of 50–100 MPa. 4.5 mm-square, 10 μm–100 μm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a2b4377679a4f3a86dd0c3a9b865010
https://doi.org/10.5104/jiepeng.3.62
https://doi.org/10.5104/jiepeng.3.62
Publikováno v:
Rigakuryoho kagaku. 20:17-23
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abddf1610ddd0464dec2b5b5ff13fbac
https://doi.org/10.1589/rika.20.17
https://doi.org/10.1589/rika.20.17
Factors Related to General Results of Clinical Internship in the Field of Physical Therapy Education
Autor:
Yoshitsugu Tanino, Kyosuke Takasaki, Takahiro Sakamoto, Takashi Nishimori, Kazuaki Kanei, Hiroaki Hirose, Shinichi Daikuya, Toshiaki Suzuki, Osamu Mihara, Ayumi Hirose
Publikováno v:
Rigakuryoho Kagaku. 19:223-227
本研究の目的は、理学療法士教育における臨床実習の成績に影響する要因を明らかにすることである。対象は，3回の臨床実習を経験した最終学年の学生39名であった。1回の臨床実習期間
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a8438a28c4666052821d638f1135475
https://doi.org/10.1589/rika.19.223
https://doi.org/10.1589/rika.19.223
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.