Zobrazeno 1 - 10
of 42
pro vyhledávání: '"Takashi Iseki"'
Publikováno v:
Journal of MMIJ, Vol 138, Iss 8, Pp 129-133 (2022)
As pyrometallurgical technologies to smelt nickel metal from the oxide ore, melting reduction process using an electric furnace (Elkem) and semi-melting reduction process using a rotary kiln (Krupp-Renn) with a saprolite ore as a raw material have be
Externí odkaz:
https://doaj.org/article/8e2f7e2ac5a64e13a9c245c720f64c49
Publikováno v:
Nano Select. 3:1148-1155
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::861255a2b4e40c22077caec0e0e7f7f6
https://doi.org/10.1002/nano.202100351
https://doi.org/10.1002/nano.202100351
Publikováno v:
Langmuir : the ACS journal of surfaces and colloids. 36(9)
On the basis of Hansen solubility parameters (HSP), we investigated octamethylsilsesquioxane (OMS), a siloxane compound with a cage-like structure and methyl side chains, as an omniphobic substance. The HSP of OMS were determined through dissolution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::be0394c3bde4979b93d433d5b09d3339
https://pubmed.ncbi.nlm.nih.gov/32097019
https://pubmed.ncbi.nlm.nih.gov/32097019
Publikováno v:
Journal of The Surface Finishing Society of Japan. 68:630-634
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::23831a618ea0bc79da802468e659faea
https://doi.org/10.4139/sfj.68.630
https://doi.org/10.4139/sfj.68.630
Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range
Autor:
Yoshinori Murakami, Satoshi Tanimoto, Shinji Sato, Yusuke Zushi, Kohei Matsui, Masato Takamori, Takashi Iseki
Publikováno v:
Materials Science Forum. :853-856
A new high-temperature die attachment system that is cost effective has been strongly desired for SiC power applications in electric vehicles and consumer electronics. This paper presents preliminary results for SiC/Zn-Al/Cu-SiN die attachments using
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b011fb1e8508be88bc09d12fdf9f7df
https://doi.org/10.4028/www.scientific.net/msf.717-720.853
https://doi.org/10.4028/www.scientific.net/msf.717-720.853
Autor:
Masato Takamori, Takashi Iseki
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 15:153-157
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68c223d02a5765870e98f5d2d971714e
https://doi.org/10.5104/jiep.15.153
https://doi.org/10.5104/jiep.15.153
Publikováno v:
Seikei-Kakou. 19:655-661
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::652cb1f5d72301753c5aea512f3ca709
https://doi.org/10.4325/seikeikakou.19.655
https://doi.org/10.4325/seikeikakou.19.655
Publikováno v:
Diamond and Related Materials. 15:1004-1010
We have investigated the structures of silicon-containing diamond-like carbon (DLC-Si) films with various silicon contents. The DLC-Si films were deposited on steel substrates at 773 K by direct current plasma-enhanced chemical vapour deposition (DC-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3568515d9d5920ffb770b09687db4463
https://doi.org/10.1016/j.diamond.2005.12.020
https://doi.org/10.1016/j.diamond.2005.12.020
Autor:
Masaki Nishioka, Hiroshi Mabuchi, Takashi Iseki, Kiyohito Okamura, Takaaki Dohmaru, Masaki Narisawa, Kazuya Shimoda, Kunio Oka
Publikováno v:
Journal of the Ceramic Society of Japan. 114:511-516
A melt-spinnable precursor for SiC based fibers was prepared from blend polymers of polycarbosilane (PCS) and polymethylsilane (PMS). After melt spinning, thermal oxidation curing, and pyrolysis, Si-C-O fibers were obtained. The addition of a small a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9eeb95cbb52f63dbcaf4f93259785a9d
https://doi.org/10.2109/jcersj.114.511
https://doi.org/10.2109/jcersj.114.511
Publikováno v:
Seikei-Kakou. 17:407-418
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f65b2a77ec062d07fb684b9c1f6a9647
https://doi.org/10.4325/seikeikakou.17.407
https://doi.org/10.4325/seikeikakou.17.407