Zobrazeno 1 - 10
of 179
pro vyhledávání: '"Takao YAKOU"'
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 83, Iss 852, Pp 17-00128-17-00128 (2017)
The radiation shielding effects on the gamma ray with the effective energy Ee = 661.7 keV and X-rays with that of Ee = 74 keV and 38 keV were examined by using the tungsten-mesh (W-Mesh) made of the tungsten wires of 18μm and 50μm, as candidate for
Externí odkaz:
https://doaj.org/article/7d6a6affd041481785da857f4e4bf380
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 80, Iss 811, Pp BMS0057-BMS0057 (2014)
We propose a method for the assessment of the optimum diameter of a pipe that is required for easy grasping, called the one point selecting method. A simple sensory evaluation method was investigated to verify the utility of this new method by compar
Externí odkaz:
https://doaj.org/article/213248c8263648a0a12ea49fa9cd8bc0
Autor:
Yoshikazu Miyata, Yuki Kuwahara, Shukuji Asakura, Tadashi Shinohara, Takao Yakou, Keiichi Shiimoto
Publikováno v:
International Journal of Corrosion, Vol 2013 (2013)
The rate equation of anodic dissolution reaction of spheroidal graphite cast iron in sulfuric acid solutions at 298 K has been studied. The cast irons have different areas of pearlite. The anodic Tafel slope of 0.043 V decade−1 and the reaction ord
Externí odkaz:
https://doaj.org/article/0cb5522e8e8b4892af36d94b94e8dd20
Autor:
Takeshi Hongo, Takao Yakou, Kenji Yoshinaga, Toshiharu Kano, Michiko Miyazaki, Takashi Hanakawa
Publikováno v:
Cerebral cortex (New York, N.Y. : 1991).
We examined the structural neuroplastic changes associated with the learning of computer programming in university students with no previous programming experience. They participated in a 15-week course (26 lessons) on the “Processing” computer p
Publikováno v:
Transactions of the JSME (in Japanese). 83:17-00128
Autor:
Satoshi Sakamoto, Keitoku Hayashi, Kenji Yamaguchi, Yasuo Kondo, Tsuyoshi Fujita, Takao Yakou
Publikováno v:
Advanced Materials Research. 1136:299-304
Thinning of the silicon wafers and decrease in kerf loss can minimize the production costs of semiconductor products. Currently, the quantity of kerf loss is about the same as the volume of the wafer itself. If we drastically reduce kerf loss, we can
Autor:
Toshitaka Satsuta, Shotaro Nagai, Hayato Takahashi, Shin-ichi Takagi, Takao Yakou, Kenji Gomi
Publikováno v:
The Proceedings of Conference of Kanto Branch. 2020:17A07
Publikováno v:
MATEC Web of Conferences, Vol 221, p 04005 (2018)
Multi-wire saws with a diamond electrodeposited wire tool are widely used to slice hard and brittle materials. The properties of the materials significantly affect the saw’s performance in terms of slicing quality, efficiency, and accuracy. In this
Autor:
Takao Yakou, Yasuo Kondo, Satoshi Sakamoto, Kenji Yamaguchi, Sanshiro Akaoka, Mitsugu Yamaguchi, Masaya Gemma
Publikováno v:
MATEC Web of Conferences, Vol 221, p 04006 (2018)
The manufacturing costs of semiconductor products such as silicon wafers can be reduced by decreasing the kerf loss. In addition, a decrease in the kerf loss leads to an effective utilization of rare materials, which is environmentally beneficial fro
Autor:
Keiichi Shiimoto, Takao Yakou, Yoshikazu Miyata, Tadashi Shinohara, Shukuji Asakura, Yuuki Kuwahara
Publikováno v:
Zairyo-to-Kankyo. 63:337-340