Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Takao Oshita"'
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 27:821-829
Since the VLSI chips were invented, as predicted by Moore’s law, the performance, the power, and the cost of the VLSI chips have been improved, which brought a significant benefit to the economy. However, some of the analog circuits do not get a fu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::379b611fb94d18636dbc81819e60c78c
https://doi.org/10.1109/tvlsi.2018.2882567
https://doi.org/10.1109/tvlsi.2018.2882567
Publikováno v:
Extended Abstracts of the 2020 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86e5cd9f4d429a58484ef7a9f5259f63
https://doi.org/10.7567/ssdm.2020.l-10-02
https://doi.org/10.7567/ssdm.2020.l-10-02
Autor:
D. Duarte, Avner Kornfeld, Nasser A. Kurd, Takao Oshita, George L. Geannopoulos, Jonathan P. Douglas, Joseph Shor
Publikováno v:
IEEE Journal of Solid-State Circuits. 51:378-390
On complex system-on-chips (SOCs), a compact on-die analog-to-digital converter (ADC) is required in high-volume testing, in order to reduce the test time and improve the test coverage of on-die analog intellectual properties (IPs). This paper presen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05e9a1bfebe5073595e8e21c5a5c5a12
https://doi.org/10.1109/jssc.2015.2501424
https://doi.org/10.1109/jssc.2015.2501424
Publikováno v:
IEEE Journal of Solid-State Circuits. 50:799-807
Compact thermal sensors ( 50 kS/sec, consumes 1.1 mW with a resolution of 0.5 °C, and has a resolution FOM of 5.7 nJ * C 2 . It is very close to the present BJT sensor state-of-the-art in its size, while being much faster and having a much better FO
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e1c8b5e98aa54059e8c9ad3fccc2f453
https://doi.org/10.1109/jssc.2015.2396522
https://doi.org/10.1109/jssc.2015.2396522
Publikováno v:
ECS Transactions. 13:253-262
Heteroepitaxial fluoride structures are candidates of material systems for quantum well devices such as resonant tunneling devices on Si substrates. Resonant tunneling diodes composed of CaF2/CdF2/CaF2 on Si(111) have been demonstrated and they exhib
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ebcb6a66f5befc3408652716a941ece5
https://doi.org/10.1149/1.2908638
https://doi.org/10.1149/1.2908638
Publikováno v:
CICC
Fabricated on a 14nm process technology node, the Intel CoreTM M and the 5th generation CoreTM processors (code named Broadwell) improve energy efficiency over the previous 22nm generation by up to 2.5x. Numerous optimizations were used in the analog
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc69e4bfc4e2859b6117b67188bf2134
https://doi.org/10.1109/cicc.2015.7338454
https://doi.org/10.1109/cicc.2015.7338454
Publikováno v:
Journal of Crystal Growth. 311:2224-2226
Epitaxial growth of fluoride quantum well structure of Ca x Sr 1− x F 2 /CdF 2 /Ca x Sr 1− x F 2 on Ge(1 1 1) is investigated. The two-step growth method was found to be useful for growth of the initial Ca x Sr 1− x F 2 layer on Ge(1 1 1) in wh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64c6dc35a9ccbf3a6d5ff9dff5a49332
https://doi.org/10.1016/j.jcrysgro.2008.10.080
https://doi.org/10.1016/j.jcrysgro.2008.10.080
Publikováno v:
2010 Japanease Journal of Applied Phiysics. 49
Equalization is the technology to improve the performance of the on-chip or input/output (I/O) serial link, and the finite/infinite impulse response (FIR/IIR) filter based design is often used as an approximation to the analog filter for equalization
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eb17a6d62b765de93f7341f72e080f74
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100607455
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100607455