Zobrazeno 1 - 2
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pro vyhledávání: '"Takanori Hiramoto"'
Publikováno v:
Journal of the Japan Institute of Metals. 72:745-750
Using the basic solution made of Bi(NO3)3•5H2O(4.0×10-3, 4.5×10-3, 5.0×10-3, 6.0×10-3, 7.0×10-3 kmol•m-3), TeO2: (3.0×10-3 kmol•m-3) and nitrilotriacetic acid (NTA: 0.1 kmol•m-3) at pH 9.5, electrochemical deposition of stoichiometric,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb6e0aa1593a94a8d9704b4f5859f085
https://doi.org/10.2320/jinstmet.72.745
https://doi.org/10.2320/jinstmet.72.745
Autor:
Norihiro Harada, Osamu Yamasaki, Naoki Idani, Toshiyuki Shibuya, Takanori Hiramoto, Daisuke Fukuda, Izumi Nitta, Yuji Kanazawa, Masaru Ito
Publikováno v:
ISQED
Chemical Mechanical Polishing (CMP)-aware design has become important for reliability and yield. Recent work on predictive models for wafer surface planarity of Cu CMP has proven that the variation of wafer surface planarity is impacted by the metal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd82993df3a50fa315209d40429d5791
https://doi.org/10.1109/isqed.2010.5450461
https://doi.org/10.1109/isqed.2010.5450461