Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Takanobu Takeda"'
Publikováno v:
Journal of Micro/Nanolithography, MEMS, and MOEMS. 17:1
A photoresist with high mechanical and thermal reliability is required for redistribution layer (RDL) formation to improve integration density and realize thinner packaging for semiconductor industries. We report on a photoresist made from a mixture
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ba2fc8c7e9dfa7a2ac124d4c4bbf459
https://doi.org/10.1117/1.jmm.17.4.043503
https://doi.org/10.1117/1.jmm.17.4.043503
Autor:
Hirokazu Hasegawa, Takanobu Takeda, Mikihito Takenaka, Naosuke Mukawa, Satoshi Akasaka, Osamu Watanabe, Shotaro Nishitsuji
Publikováno v:
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS. 7(6):589-594
We have investigated microdomain structures of novel block copolymers, poly(p-tert-pentyloxyvinylbebzene-b-p-vinylphenol) and poly(p-tert-pentyloxy-vinylbebzene-b-p-vinylphenol-b-p-tert-pentyloxyvinylbebzene) with small-angle X-ray scattering (SAXS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::08b2965113fa66e7b254975e1740eb60
http://hdl.handle.net/2433/35837
http://hdl.handle.net/2433/35837
Autor:
Takanobu Takeda, Takeshi Kinsho, Yoshio Kawai, Jun Hatakeyama, Mutsuo Nakashima, Toshinobu Ishihara
Publikováno v:
Journal of Photopolymer Science and Technology. 17:519-525
Polysilsesquioxane (SSQ) and alternating-copolymers of silicon containing olefin with maleic anhydride (SiMA) have been employed as backbone polymers of silicon containing bilayer resists. Several kinds of functional alkoxysilanes to form SSQ and sil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abbcb94cbd2623a352be4c0f93ac58d1
https://doi.org/10.2494/photopolymer.17.519
https://doi.org/10.2494/photopolymer.17.519
Publikováno v:
Organometallics. 13:4543-4546
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a98a11ed5bd97a49e6ae2df978f8e725
https://doi.org/10.1021/om00023a066
https://doi.org/10.1021/om00023a066
Publikováno v:
The Journal of Organic Chemistry. 59:5824-5827
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92c38d0ad7ea3ffde3077e3ca7337bf8
https://doi.org/10.1021/jo00098a053
https://doi.org/10.1021/jo00098a053
Publikováno v:
ChemInform. 26
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a481d7d0811a9f2058937c3054b73462
https://doi.org/10.1002/chin.199514082
https://doi.org/10.1002/chin.199514082
Publikováno v:
ChemInform. 29
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a97414c565bd298c51f2d008568427b5
https://doi.org/10.1002/chin.199804057
https://doi.org/10.1002/chin.199804057
Publikováno v:
Polymer Journal. 22:429-434
Although γ-butyrolactone is not reactive enough toward the amino groups of chitosan, the β-form has been found to give N-hydroxyacylated derivatives. The conditions for the reactions were studied in detail, and efficient procedures have been establ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0d38940f6e55d2a8d779daa1e9fc045
https://doi.org/10.1295/polymj.22.429
https://doi.org/10.1295/polymj.22.429
Publikováno v:
Journal of the American Chemical Society. 128(39)
Dimetalated amides 1 (Y = O) were generated as the synthons of carbamoyllithiums 2 (Y = O) by the reaction of isocyanates with iBu2AlTenBu and a subsequent tellurium−lithium exchange reaction. A series of amide derivatives 3 (Y = O) were obtained b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a7d635ab0d0275a94a7da6f762d4ba18
https://pubmed.ncbi.nlm.nih.gov/17002350
https://pubmed.ncbi.nlm.nih.gov/17002350
Publikováno v:
Advances in Resist Technology and Processing XX.
Silicon containing bi-layer resist systems for 193nm lithography have been developed for sub-100nm pattern fabrication. Lithographic characteristics of thin film top layer resist show the advantages of high resolution and wide process window. Thick u
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64049f8165f4be976872f5cbf7cb6ee5
https://doi.org/10.1117/12.483775
https://doi.org/10.1117/12.483775