Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Takaki Etou"'
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 2:62-68
In this study, 60 solder compositions were examined in an effort to improve the integrity against impact loads of the solder joints on an electroless Ni–P/Au surface finish. The Ag, Cu, and Ni contents in the Sn-based solder varied from 0 to 4.5 wt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea8f50cb3b1f792fb89a81d5e2d9f2eb
https://doi.org/10.5104/jiepeng.2.62
https://doi.org/10.5104/jiepeng.2.62
Autor:
Masafumi Miyata, Takahiro Sugano, Takaki Etou, Shunsuke Yamamoto, Akihiro Kashiwazaki, Toshiro Tanabe
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C. 66:1935-1942
Currently, the seismic design method of a container crane is adopted the 'seismic coefficient method'(pseudo static method). In case of extremely high intensity input seismic motion such as Level 2, the dynamic behavior of a container crane is expres
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aae55132588ebbdba4bc6f074cfc907b
https://doi.org/10.1299/kikaic.66.1935
https://doi.org/10.1299/kikaic.66.1935