Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Takahito Sekido"'
Autor:
Katsutoshi Ihara, Masashi Okaniwa, Kohei Higashiguchi, Takahito Sekido, Tsuyoshi Kida, Shu Yoshida
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:11-17
Internet of Things (IoT) accelerated by the rapid progress of 5G is bringing a lot of challenges to semiconductor packaging technologies. In particular, flip-chip bonding technology is strongly required to realize ultrafine-pitch products, such as ne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d92e65ebd8c7f1f4a7d4c006875ddea
https://doi.org/10.1109/tcpmt.2019.2950697
https://doi.org/10.1109/tcpmt.2019.2950697
Autor:
Kohei Higashiguchi, Katsutoshi Ihara, Tsuyoshi Kida, Takahito Sekido, Shu Yoshida, Masashi Okaniwa, Takenori Takiguchi, Toyoji Oshima
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
TCB (Thermal Compression Bonding) process with NCF (Non Conductive Film) is expected as an effective solution for fine pitch applications brought by the progress of IoT (Internet of Things), however the production volume is limited to small level bec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0041486157426a30651751f9849ab18e
https://doi.org/10.1109/estc.2018.8546397
https://doi.org/10.1109/estc.2018.8546397