Výsledky vyhledávání - "Takahiro Daikoku"

Conditions for Homogeneous and Rapid Deposition of Si Film on Semiconductor Wafers

Autor: Takafumi Sasaki, Takahiro Daikoku, Kazuhiro Morimitsu, Masanao Fukuda, Kazushige Kikuta, Takemi Chikahisa, Takao Hishinuma

Publikováno v: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 73:1599-1605

The paper investigates the method of improving deposition rate in semiconductor deposition process, while maintaining film thickness uniformity and step coverage in a vertical LPCVD (Low-Pressure Chemical Vapor Deposition) system. In general increasi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6ae229e1a956ef3b86a19f5525d20410
https://doi.org/10.1299/kikaib.73.1599

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Air-Cooled Heat Sink for Electronic Equipment. Heat Transfer Characteristics of Inclined Strip Fins and a Multiflow Air Duct System

Autor: Toshio Hatada, Takahiro Daikoku, Takayuki Atarashi

Publikováno v: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 60:620-626

A high-performance air cooling system unifying the heated plates temperature distribution is investigated. The plates are arranged in series and cooled by serial air flow. As a result of the investigations, fins with projections and a multiflow air d

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::cf9740d3e9823db0d89ce6fc8918895b
https://doi.org/10.1299/kikaib.60.620

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Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling

Autor: Takahiro Daikoku, Shigekazu Kieda, Noriyuki Ashiwake, Shizuo Zushi

Publikováno v: Journal of Electronic Packaging. 115:270-275

A stochastic finite element method is applied to thermal analysis of cooling in large-scale computers using a multi-fin flexible thermal contactor. The stochastic finite element method is a general technique to incorporate the effect of stochastic or

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::80596a3f6165f7f0b7caaa580d73cffd
https://doi.org/10.1115/1.2909328

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A Simple Analysis Method of Thermal Resistance of Plastic IC Packages

Autor: Sueo Kawai, Ichio Simizu, Takahiro Daikoku, Makoto Kitano

Publikováno v: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 57:1846-1850

Thermal design of plastic IC packages is becoming more important as heat generation of chips increases. Since a large parameter survey is required in the actual design of IC's, numerical analysis such as the finite element method may not always be ap

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4a75910071517425ee1edbe898623b4f
https://doi.org/10.1299/kikaib.57.1846

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Effects of Pore Diameters and System Pressure on Saturated Pool Nucleate Boiling Heat Transfer From Porous Surfaces

Autor: Takahiro Daikoku, Tadakatsu Nakajima, Wataru Nakayama

Publikováno v: Journal of Heat Transfer. 104:286-291

The porous surface structure was manufactured with precision for the experimental study of nucleate boiling heat transfer in R-11. Boiling curves and the data of bubble formation were obtained with a variety of geometrical and operational parameters;

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d1bfc164417ee8e08474973b8270cdd3
https://doi.org/10.1115/1.3245085

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