MEMS for Photonic Integrated Circuits

Autor: Errando-Herranz, Carlos, Takabayashi, Alain Yuji, Edinger, Pierre, Sattari, Hamed, Gylfason, Kristinn B., Quack, Niels

Publikováno v: C. Errando-Herranz, A. Y. Takabayashi, P. Edinger, H. Sattari, K. B. Gylfason and N. Quack, IEEE Journal of Selected Topics in Quantum Electronics, vol. 26, no. 2, pp. 1-16, March-April 2020, Art no. 8200916

The field of microelectromechanical Systems (MEMS) for photonic integrated circuits (PICs) is reviewed. This field leverages mechanics at the nanometer to micrometer scale to improve existing components and introduce novel functionalities in PICs. Th

Externí odkaz: http://arxiv.org/abs/2212.05169

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Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding

Autor: Jo, Gaehun, Edinger, Pierre, Bleiker, Simon J., Wang, Xiaojing, Takabayashi, Alain Yuji, Sattari, Hamed, Quack, Niels, Jezzini, Moises, Lee, Jun Su, Malik, Arun Kumar, Verheyen, Peter, Zand, Iman, Khan, Umar, Bogaerts, Wim, Stemme, Göran, Gylfason, Kristinn, Niklaus, Frank

The field of silicon (Si) photonic micro-electromechanical system (MEMS) for photonic integrated circuits (PICs) has evolved rapidly. Thanks to the ultra-low power consumption of Si photonic MEMS, it enables a wide range of high-performance photonic

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______260::0b3634e10ef5476034b01e1080e7fbf8
http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-322074

Low-power actuators for programmable photonic processors

Autor: Jalali, Bahram, Kitayama, Ken-ichi, Khan, Umar, Zand, Iman, Van Iseghem, Lukas, Edinger, Pierre, Jo, Gaehun, Bleiker, Simon J., Takabayashi, Alain Yuji, Antony, Cleitus, Jezzini, Moises, Talli, Giuseppe, Sattari, Hamed, Lee, Jun Su, Mallik, Arun Kumar, Verheyen, Peter, Arce, Cristina Lerma, Garcia, Marco, Jonuzi, Tigers, Picavet, Ewout, Nagarjun, K. P., Watté, Jan, Quack, Niels, Niklaus, Frank, Gylfason, Kristinn B., De Buysser, Klaartje, Beeckman, Jeroen, Bogaerts, Wim

Publikováno v: Proceedings of SPIE; April 2023, Vol. 12438 Issue: 1 p124380K-124380K-12, 12313633p