Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Takaaki Anada"'
Autor:
Kenichiro Sasamori, Seishi Kumamoto, Eiichiro Matsubara, Hisamichi Kimura, Tetsu Ichitsubo, Hisao Irie, Masahiko Yamaguchi, Takaaki Anada
Publikováno v:
JOURNAL OF THE JAPAN INSTITUTE OF METALS. 70(2):162-165
Sn-Zn based solder alloys are expected to be a potential candidate as a lead-free low temperature solder because of its melting point close to that of Sn-Pb. There are, however, several problems in practical application. Cu-Zn intermetallic compound
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::be7e522b73b9092435170a29acfc4895
http://hdl.handle.net/2433/35111
http://hdl.handle.net/2433/35111
Autor:
Hisao Irie, Tetsu Ichitsubo, Takaaki Anada, Seishi Kumamoto, Kozo Fujiwara, Masahiko Yamaguchi, Eiichiro Matsubara
Publikováno v:
Journal of Alloys and Compounds. 392:200-205
Effects of additives, Cu and Ni, on intermetallic compound formation at the interface between Sn–Zn-based solder and Cu substrate have been studied. (Sn91Zn9)99.98−xMxAl0.02 (wt.%) solder (M = Cu or Ni) alloys were prepared. The microstructures o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50ec035465857e6d7195fac297ce748f
https://doi.org/10.1016/j.jallcom.2004.09.043
https://doi.org/10.1016/j.jallcom.2004.09.043