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Autor:
Russell D. Dupuis, Jiming Bao, Theeradetch Detchprohm, Shahab Shervin, Tain Tong, Kamrul Alam, R. L. Forrest, Mi-Hee Ji, Jae-Hyun Ryou, Sara Pouladi, Jie Chen, Mina Moradnia
Publikováno v:
Journal of Materials Chemistry C. 9:2243-2251
Flexible electronics and mechanically bendable devices based on Group III-N semiconductor materials are emerging; however, there are several challenges in manufacturing, such as cost reduction, device stability and flexibility, and device-performance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::184a453bb4b09fe3558c4a53819cb415
https://doi.org/10.1039/d0tc04634e
https://doi.org/10.1039/d0tc04634e
