Zobrazeno 1 - 10
of 91
pro vyhledávání: '"Tai Chong Chai"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Hsiang-Yao Hsiao, David Soon Wee Ho, Ser Choong Chong, Tai Chong Chai, David Schutzberger, Yariv Oz, Guy Amrani
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Autor:
Sharon Pei Siang Lim, Ser Choong Chong, David Ho Soon Wee, Wen Wei Seit, Jacob Jordan Soh, Tai Chong Chai
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
For mm-wave application, the size of package with antenna becomes very small, which poses critical challenge for heat dissipation issue. The function demand for high performance and higher duty-cycled condition makes the thermal issue even more sever
Autor:
Tai Chong Chai, Lin Ji
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
A Finite Element Analysis (FEA) modelling study on solder joint fatigue life assessment under thermal cycling conditions for two High Density (HD) Fan Out Wafer Level Packaging (FOWLP) packages is presented in this paper. Package designs and material
Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
One of the challenges in processing Fan Out Wafer Level Package is the warpage of the Molded Wafer. Some of the fabrication processes such as lithography, coating, etching, and plating could not process wafer with high warpage. Therefore, the molded
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:854-863
A single-phase high power electronics package is designed and developed in this paper. The developed power package achieves a significant thermal performance improvement compared with the conventional wire-bonded power package. The improvement is att
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:786-796
The fan-out interposer (FOI) technology with fine pitch is demonstrated and presented for heterogeneous integration as a cost-effective and enabling technology. The co-design modeling methodology is established for the FOI technology, including wafer