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Publikováno v:
2014 IEEE International Conference on Semiconductor Electronics (ICSE2014).
In the manufacturing process, metal capping for EMI shielding is done during the integrated circuit (IC) assembly process, which hinders the attempt of reducing the size of electronic device and also incurs higher cost of assembly. Therefore direct d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdb23302a17a7ea3fec95b4b7db51167
https://doi.org/10.1109/smelec.2014.6920860
https://doi.org/10.1109/smelec.2014.6920860
