Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Taek Yeong Lee"'
Autor:
Chan-Young Kim, Ha-Eun Lim, Gaeun Yang, Sukjeang Kwon, Chan-Hee Kang, Sang-Chul Lim, Taek Yeong Lee
Publikováno v:
Korean Journal of Materials Research. 33:142-150
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a62b01637ea255b6ac0b9229dd41f0c0
https://doi.org/10.3740/mrsk.2023.33.4.142
https://doi.org/10.3740/mrsk.2023.33.4.142
Publikováno v:
Journal of Nanoscience and Nanotechnology. 12:3593-3596
An in-situ electrical conductivity measurement of thin films of tin oxide nanoclusters for nano-devices was performed during metal cluster deposition and subsequent oxidation. From the current observation, the percolation threshold and the oxidation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82d1f2b974d7dbb1adedcb130db2edd5
https://doi.org/10.1166/jnn.2012.5626
https://doi.org/10.1166/jnn.2012.5626
Publikováno v:
Journal of Electronic Materials. 37:1858-1862
Aluminum was added into Sn-3.0Ag (wt.%) solder to investigate the effect of aluminum concentration on the interfacial reaction of Sn-3.0Ag-xAl solders with copper or electroless nickel immersion gold (ENIG) metallizations. Four different Sn-3.0Ag-xAl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e590c9803aa8d41f09a5b64bf45228b0
https://doi.org/10.1007/s11664-008-0548-7
https://doi.org/10.1007/s11664-008-0548-7
Autor:
Yong Dae Choi, Ki-Deuk Min, Bong Gyoo Cho, Jong Han Chun, Jongwon Lee, Hong-Kee Lee, Dae Jung Kim, Taek Yeong Lee
Publikováno v:
Journal of Materials Science: Materials in Electronics. 19:85-90
The current study performed the growth of BaTiO3 thin film on p-Si substrate by using RF-Magnetron sputtering system and the effects of thickness and particle size of the thin film on several structural characteristics of thin film were investigated.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2486278ad756fafc65de0ac407ca0299
https://doi.org/10.1007/s10854-007-9353-y
https://doi.org/10.1007/s10854-007-9353-y
Autor:
Taek-Yeong Lee, Deuk-Han Kim, Il-Suk Kang, Jun-Mo Yang, Chi Won Ahn, Hyun-Sang Seo, Wook-Jung Hwang
Publikováno v:
Journal of nanoscience and nanotechnology. 10(5)
Metal nanoclusters were fabricated by inert-gas condensation in a sputtering reactor. From transmission electron microscopy, it was confirmed that copper nanoclusters with a high degree of monodispersity in size of about 5 nm were successfully produc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6c6d6edfe38c090e26202e25279a4aa0
https://pubmed.ncbi.nlm.nih.gov/20359024
https://pubmed.ncbi.nlm.nih.gov/20359024
Publikováno v:
2007 International Conference on Electronic Materials and Packaging.
In the present work, Kirkendall void formation and drop impact reliability between Pb-free solder and Cu metallization were investigated. Pb-free solders, Sn-3.5 Ag and Sn-3.5 Ag-xZn (x=0.1, 0.5, 1, 3, and 7 wt%), were reacted with Cu metallization.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4239b75b607b08dfc28ddd8d9a49535d
https://doi.org/10.1109/emap.2007.4510330
https://doi.org/10.1109/emap.2007.4510330
Autor:
Young-min Lee, Young-Mee Jee, Ki-Hyun Kim, June-Hyeon Ahn, Ho-Seong Seo, Taek-Yeong Lee, Jin Yu, Yoonchul Sohn
Publikováno v:
2006 International Conference on Electronic Materials and Packaging.
The mechanical reliability of surface finishes ; electroless Ni(P)/Au(ENIG), Cu OSP and electrolytic Ni/Au finishes, were evaluated with Sn-3.0Ag-0.5Cu (all in wt.% unless specified otherwise) and Sn-36.8Pb-0.4Ag solder by lap shear and bending tests
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f1a69d396f0f3cd80934805be7db6b2
https://doi.org/10.1109/emap.2006.4430678
https://doi.org/10.1109/emap.2006.4430678
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
A systematic investigation of mechanical testing was conducted to correlate the brittle fracture observed in Ni(P) metallization with Ni-Sn intermetallic spalling in Pb-free solder joints. To produce lap shear test samples, two FR4 PCBs finished with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a4ef85a8c6d9a73ec05639b2f228293
https://doi.org/10.1109/ectc.2005.1441250
https://doi.org/10.1109/ectc.2005.1441250
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Electroless Ni-P has been widely used for under bump metallization (UBM) of flip chip and surface finish layer in microelectronics packaging because of its excellent solderability, corrosion resistance, uniformity, selective deposition without photol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a9118610cb6e1d575e9f0d37bb2779c
https://doi.org/10.1109/ectc.2004.1319318
https://doi.org/10.1109/ectc.2004.1319318
Publikováno v:
Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC).
Intermetallic compound (IMC) spalling from electroless Ni-P film was investigated with lead-free solders (Sn-3.5 wt.% Ag and pure Sn) in terms of solder deposition method (electroplating, solder paste and solder preform) and P content in Ni-P layer (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6262da59a19a249a4c15893ba189298
https://doi.org/10.1109/agec.2004.1290897
https://doi.org/10.1109/agec.2004.1290897