Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Taein Shin"'
Autor:
Seungtaek Jeong, Tae-Wook Kim, Seongsoo Lee, Boogyo Sim, Hyunwook Park, Kyungjune Son, Keeyoung Son, Seongguk Kim, Taein Shin, Young-Cheon Kim, Joungho Kim, Byoung-Joon Kim
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1748-1756
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c98ac88a3a3d248567018ea1d7f609d2
https://doi.org/10.1109/tcpmt.2022.3217291
https://doi.org/10.1109/tcpmt.2022.3217291
Autor:
Hyunwook Park, Minsu Kim, Seongguk Kim, Keunwoo Kim, Haeyeon Kim, Taein Shin, Keeyoung Son, Boogyo Sim, Subin Kim, Seungtaek Jeong, Chulsoon Hwang, Joungho Kim
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 70:4772-4786
In this article, for the first time, we propose a transformer network-based reinforcement learning (RL) method for power distribution network (PDN) optimization of high bandwidth memory (HBM). The proposed method can provide an optimal decoupling cap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9f07de8d6edb0c13ba8e77afcd99c262
https://doi.org/10.1109/tmtt.2022.3202221
https://doi.org/10.1109/tmtt.2022.3202221
Autor:
Keeyoung Son, Seongguk Kim, Hyunwook Park, Taein Shin, Keunwoo Kim, Minsu Kim, Boogyo Sim, Subin Kim, Gapyeol Park, Shinyoung Park, Seungtaek Jeong, Joungho Kim
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1542-1556
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef167b1b9655add87ed34832b403251e
https://doi.org/10.1109/tcpmt.2022.3201673
https://doi.org/10.1109/tcpmt.2022.3201673
Autor:
Keeyoung Son, Daehwan Lho, Keunwoo Kim, Seonguk Choi, Haeyeon Kim, Hyunwook Park, Boogyo Sim, Hyunwoo Kim, Taein Shin, Joungho Kim
Publikováno v:
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0609d715c091b8cad78d134aa779268b
https://doi.org/10.1109/edaps56906.2022.9995613
https://doi.org/10.1109/edaps56906.2022.9995613
Autor:
Hyunwoo Kim, Haeyeon Kim, Joonsang Park, Keeyoung Son, Hyunwook Park, Taein Shin, Keunwoo Kim, Jiwon Yoon, Junghyun Lee, Jonghyun Hong, Juneyoung Kim, Joungho Kim
Publikováno v:
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3388ed33388e5c2e2fbac3d98531eabc
https://doi.org/10.1109/edaps56906.2022.9995183
https://doi.org/10.1109/edaps56906.2022.9995183
Autor:
HyunWook Park, Daehwan Lho, Kyungjun Cho, Seongguk Kim, Gapyeol Park, Shinyoung Park, Youngwoo Kim, Kyungjune Son, Subin Kim, Seungtaek Jeong, Joungho Kim, Taein Shin
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1955-1970
In this paper, we propose a processing-in-memory of high bandwidth memory (PIM-HBM) scheme including system architecture and hardware structure. The proposed scheme embeds processing units into the logic layer of the HBM to expose an excess dynamic r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::524205c6b7cdce0139d0a269443f09df
https://doi.org/10.1109/tcpmt.2021.3117071
https://doi.org/10.1109/tcpmt.2021.3117071
Autor:
Keunwoo Kim, Junghyun Lee, Seokwoo Hong, Hyunwoo Kim, Boogyo Sim, Kyungjune Son, Taein Shin, Keeyoung Son, Jinyoung Kim, Kyubong Kong, Joungho Kim
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7e3ada9f3965120626325babe277633
https://doi.org/10.1109/epeps53828.2022.9947123
https://doi.org/10.1109/epeps53828.2022.9947123
Autor:
Boogyo Sim, Keunwoo Kim, Taein Shin, Hyunwook Park, Seongguk Kim, Daehwan Lho, Keeyoung Son, Kyubong Kong, Seungtaek Jeong, Seonguk Choi, Jihun Kim, Joungho Kim
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f06878688341fe2a45c6b6c5f6ac5b6
https://doi.org/10.1109/epeps53828.2022.9947140
https://doi.org/10.1109/epeps53828.2022.9947140
Autor:
Kyungjune Son, Keunwoo Kim, Gapyeol Park, Daehwan Lho, Hyunwook Park, Boogyo Sim, Taein Shin, Joonsang Park, Haeyeon Kim, Joungho Kim, Kyubong Gong
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f601cd820e588666383c4ded6fc4ecc
https://doi.org/10.1109/epeps53828.2022.9947197
https://doi.org/10.1109/epeps53828.2022.9947197
Autor:
Hyunwook Park, Taein Shin, Seongguk Kim, Daehwan Lho, Boogyo Sim, Jinwook Song, Kyubong Kong, Joungho Kim
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::333bc5a16a59467e56cf39ca61c87f10
https://doi.org/10.1109/epeps53828.2022.9947166
https://doi.org/10.1109/epeps53828.2022.9947166