Zobrazeno 1 - 8
of 8
pro vyhledávání: '"TaeKyeong Hwang"'
Autor:
GyuIck Jung, SooHyun Kim, HoDol Yoo, WonChul Do, TaeKyeong Hwang, WonMyoung Ki, JaeHun Bae, InSu Mok, SeungMan Ryu
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a wafer-level compression molding process. The redistribution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57f86d541912049fab1dc55bb89e4dc6
https://doi.org/10.1109/eptc50525.2020.9315128
https://doi.org/10.1109/eptc50525.2020.9315128
Autor:
KiYeul Yang, Nathan Whitchurch, Michael G. Kelly, Curtis Zwenger, George J. Scott, TaeKyeong Hwang, WonMyoung Ki, JongHyun Jeon, JaeHun Bae
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
As the costs of advanced node silicon have risen sharply with the 7 and 5-nanometer nodes, advanced packaging is coming to a crossroad where it is no longer fiscally prudent to pack all desired functionality into a single die. While single-die packag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f8fc9cf35c1f1a5a48418753c05f7ca
https://doi.org/10.1109/ectc32862.2020.00145
https://doi.org/10.1109/ectc32862.2020.00145
Autor:
MinJae Lee, Keun-Soo Kim, Hwankyu Kim, DaeByoung Kang, TaeKyeong Hwang, Juhoon Yoon, David Jon Hiner, Dong Wook Kim, Seokgeun Ahn
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
High throughput interconnection technology has been achieved using a multi-chip gang bonding process with an advanced chip on wafer (CoW) test vehicle (TV). The TV had 30 µm of fine-pitch copper pillar (CuP) and the bonding test was performed using
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c24317a371879b0755b352617f483977
https://doi.org/10.1109/ectc.2016.171
https://doi.org/10.1109/ectc.2016.171
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
As one of the alternative materials in chip interconnection, copper wire has become popular because of its lower cost and higher electrical conductivity than gold wire. Moreover it is known that long term reliability performance at high temperature o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c4318a10c8b7083de825dff353af3df
https://doi.org/10.1109/ectc.2011.5898747
https://doi.org/10.1109/ectc.2011.5898747
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Flip Chip (FC) technology has now become mainstream solution for high-performance packages. From commercial gaming machines to high-reliability servers, FC package is gaining more market share over traditional packaging technologies, such as wire bon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad8cde14b6a3f71e85f2561bbdfe94ac
https://doi.org/10.1109/ectc.2011.5898599
https://doi.org/10.1109/ectc.2011.5898599
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1.
Flip Chip (FC) technology has now become the mainstream solution for high performance packages. From commercial gaming machines to high reliability servers, the FC package is gaining more market share over traditional packaging technologies, such as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ade321753cedc8be5342704141c31bd
https://doi.org/10.1115/ipack2011-52260
https://doi.org/10.1115/ipack2011-52260
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1740-1745, 6p
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p767-774, 8p