Zobrazeno 1 - 10
of 50
pro vyhledávání: '"Tae-Ik Lee"'
Publikováno v:
Scientific Reports, Vol 13, Iss 1, Pp 1-8 (2023)
Abstract A fast and straightforward fabrication process for producing a robust, flexible, and transparent conductive film was demonstrated using nanowelding of Ag nanowires through pressure-assisted microwave irradiation. This innovative process effe
Externí odkaz:
https://doaj.org/article/1169b19b90d04254a177a698b079baea
Autor:
Gyuwon Jeong, Dong-Yurl Yu, Seongju Baek, Junghwan Bang, Tae-Ik Lee, Seung-Boo Jung, JungSoo Kim, Yong-Ho Ko
Publikováno v:
Materials, Vol 14, Iss 2, p 335 (2021)
The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based
Externí odkaz:
https://doaj.org/article/3f6a38a695fd4527babac2c9adcea6f7
Autor:
Hyun-Ik Jang, Hae-Su Yoon, Tae-Ik Lee, Sangmin Lee, Taek-Soo Kim, Jaesool Shim, Jae Hong Park
Publikováno v:
Nanomaterials, Vol 10, Iss 12, p 2414 (2020)
In this study, curved nanostructures, which are difficult to obtain, were created on an Si substrate through the bonding, swelling, and breaking processes of the polymer and silicone substrate. This method can be utilized to obtain convex nanostructu
Externí odkaz:
https://doaj.org/article/832b36694c9e42208c955ff5ca1ba226
Publikováno v:
Polymers, Vol 7, Iss 6, Pp 985-1004 (2015)
This paper presents a warpage analysis method that predicts the warpage behavior of electroplated Cu films on glass fiber-reinforced polymer (GFRP) packaging substrates. The analysis method is performed using the following sequence: fabricate specime
Externí odkaz:
https://doaj.org/article/d7e0833810f146d09fb2b84e5ac41335
Publikováno v:
ACS Applied Nano Materials; 7/26/2024, Vol. 7 Issue 14, p16534-16541, 8p
Autor:
Byeongjin Ahn, Jahyeon Kim, Gyeong-Yeong Cheon, Tae-Ik Lee, Young-Bae Park, Jungsoo Kim, Yong-Ho Ko
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:21127-21136
Autor:
Han Eol Lee, Daewon Lee, Tae-Ik Lee, Jinhyeong Jang, Junho Jang, Young-Woo Lim, Jung Ho Shin, Seung-Mo Kang, Gwang-Mun Choi, Daniel J. Joe, Jeong Hyeon Kim, Seung Hyung Lee, Sang Hyun Park, Chan Beum Park, Taek-Soo Kim, Keon Jae Lee, Byeong-Soo Bae
Publikováno v:
ACS Applied Materials & Interfaces. 14:28258-28269
Flexible micro-light-emitting diodes (f-μLEDs) have been regarded as an attractive light source for the next-generation human-machine interfaces, thanks to their noticeable optoelectronic performances. However, when it comes to their practical utili
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:360-367
In this article, chip-on-fabric (COFa) assemblies using anisotropic conductive films (ACFs) and metal-laminated fabric substrates were investigated. To fabricate the metal-laminated fabric substrates, electroless nickel–immersion gold (ENIG) metal-
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:176-183
Cu pattern-laminated fabric substrates using epoxy-based B-stage adhesive films were demonstrated. Fine-pitch Cu electrical patterns were fabricated on B-stage adhesive films and then laminated to fabrics. As a result, fabric substrates having minimu
Publikováno v:
Microelectronics Reliability. 138:114652