Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Tae Sik Yun"'
Autor:
Jun-Sang Ham, Kangil Lee, Ji-Houn Kang, Mhan-Pyo Yang, Tae Sik Yun, Byeong-Teck Kang, Wan-Kyu Lee
Publikováno v:
Korean Journal of Veterinary Research. 60:19-24
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64b0e207c2c3854e477fd001aeba8b92
https://doi.org/10.14405/kjvr.2020.60.1.19
https://doi.org/10.14405/kjvr.2020.60.1.19
Autor:
Myeong-Jae Park, Ho Sung Cho, Tae-Sik Yun, Sangjin Byeon, Young Jun Koo, Sangsic Yoon, Dong Uk Lee, Seokwoo Choi, Jihwan Park, Jinhyung Lee, Kyungjun Cho, Junil Moon, Byung-Kuk Yoon, Young-Jun Park, Sang-muk Oh, Chang Kwon Lee, Tae-Kyun Kim, Seong-Hee Lee, Hyun-Woo Kim, Yucheon Ju, Seung-Kyun Lim, Seung Geun Baek, Kyo Yun Lee, Sang Hun Lee, Woo Sung We, Seungchan Kim, Yongseok Choi, Seong-Hak Lee, Seung Min Yang, Gunho Lee, In-Keun Kim, Younghyun Jeon, Jae-Hyung Park, Jong Chan Yun, Chanhee Park, Sun-Yeol Kim, Sungjin Kim, Dong-Yeol Lee, Su-Hyun Oh, Taejin Hwang, Junghyun Shin, Yunho Lee, Hyunsik Kim, Jaeseung Lee, Youngdo Hur, Sangkwon Lee, Jieun Jang, Junhyun Chun, Joohwan Cho
Publikováno v:
2022 IEEE International Solid- State Circuits Conference (ISSCC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6ee4429cdb7e1fb1952af0827370830
https://doi.org/10.1109/isscc42614.2022.9731562
https://doi.org/10.1109/isscc42614.2022.9731562
Autor:
Tae Sik Yun1, Chunmei Lin2, Jung-Min Yon1, Seul Gi Park1, Lee Wha Gwon1, Jong-Geol Lee1, In-Jeoung Baek3, Sang-Seop Nahm4, Beom Jun Lee1, Young Won Yun1, Sang-Yoon Nam1 synam@cbu.ac.kr
Publikováno v:
Korean Journal of Veterinary Research. 2018, Vol. 58 Issue 4, p183-192. 10p.
Autor:
Byung Kuk Yun, Sang-Kwon Lee, Woo-Young Lee, Seung-chan Kim, Junghyun Shin, Jung-Hwan Lee, Tae-Kyun Kim, Dong Uk Lee, SeungGyeon Lim, Kyo-Won Jin, Jae-Seung Lee, Sang Hun Lee, Tae Sik Yun, Sangmuk Oh, Jong Chan Yun, Ho Sung Cho, Doobock Lee, Chun-Seok Jeong, Ji Hwan Park, Chul Kim, Jiho Choi, Yucheon Ju, Min Jeong Kim, Ji-hwan Kim, Daeyong Shim, Seokwoo Choi, Seong Hee Lee, Woo Sung We, Young Jun Ku, Hyun Jung Kim, Young Jun Park, Kang Seol Lee, Jun Il Moon, Junhyun Chun, Chang Kwon Lee, Young-Do Hur, Myeong-Jae Park
Publikováno v:
ISSCC
There is enormous demand for high-bandwidth DRAM: in application such as HPC, graphics, high-end server and artificial intelligence. HBM DRAM was developed [1] using the advances in package technology: TSV, microbump and silicon-interposer. Owing to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5503c3565d0bcc46cda895fa7bd89877
https://doi.org/10.1109/isscc19947.2020.9062977
https://doi.org/10.1109/isscc19947.2020.9062977
Autor:
Jonghoon Oh, Dong Beom Lee, Jong Chern Lee, Kyung Whan Kim, Tae Sik Yun, Hyeon Gon Kim, Sangmuk Oh, Jae-Jin Lee, Young Jun Ku, Hongjung Kim, Ho Sung Cho, Jun Hyun Chun, Hyun-Sung Lee, Ki Hun Kwon, Ji-hwan Kim, Young Jae Choi, Seok-Hee Lee, Chun-Seok Jeong, Dae Suk Kim
Publikováno v:
ISOCC
In this paper, HBM DRAM with TSV technique is introduced. This paper covers the general TSV feature and techniques such as TSV architecture, TSV reliability, TSV open / short test, and TSV repair. And HBM DRAM, representative DRAM product using TSV,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12e2566f6de4e93bbf2dd1c9055d10a7
https://doi.org/10.1109/isocc.2016.7799847
https://doi.org/10.1109/isocc.2016.7799847
Autor:
Jong Chern Lee, Kyung Whan Kim, Hyun-Sung Lee, Chun-Seok Jeong, Jae Hwan Kim, Young Jae Choi, Ho Sung Cho, Young Jun Ku, Hyeon Gon Kim, Ji-hwan Kim, Dae Suk Kim, Yeon Ok Kim, Ki Hun Kwon, Jonghoon Oh, Hongjung Kim, Jun Hyun Chun, Tae Sik Yun, Sangmuk Oh, Dong Beom Lee, Jeajin Lee, Jin Ho Kim, Seok-Hee Lee
Publikováno v:
ISSCC
Because of the expansion of high performance computing (HPC) and server market, demand for HBM DRAM is increasing. With this market flow, diverse customers require various HBM product families. One customer requirement is full bandwidth with less den
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d21c1f66791c5c03863984edc2c4b838
https://doi.org/10.1109/isscc.2016.7418035
https://doi.org/10.1109/isscc.2016.7418035