Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Tadayuki Shimura"'
Publikováno v:
2006 European Microwave Integrated Circuits Conference.
A low cost molded MMIC in a QFN package is designed and fabricated for a Ku-band high power amplifier. The generic plastic-molded QFN package contributes to the reduction of the assembly cost. To achieve high reliability with respect to humidity, the
Autor:
Yoshio Aoki, Tadayuki Shimura, Yoji Ohashi, Toshihiro Shimura, Aoki Shigenori, Hiroki Someta, Yoshihiro Kawasaki, Tatsuya Hirose
Publikováno v:
28th European Microwave Conference, 1998.
We have developed novel hermetically sealed package with through-hole for the use in low-cost millimeter-wave applications. The package is available with specifications ranging from DC to 85 GHz. The insertion loss at feed-through of the package is l
Conference
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