Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Tadayuki Shimura"'
Publikováno v:
2006 European Microwave Integrated Circuits Conference.
A low cost molded MMIC in a QFN package is designed and fabricated for a Ku-band high power amplifier. The generic plastic-molded QFN package contributes to the reduction of the assembly cost. To achieve high reliability with respect to humidity, the
Autor:
Yoshio Aoki, Tadayuki Shimura, Yoji Ohashi, Toshihiro Shimura, Aoki Shigenori, Hiroki Someta, Yoshihiro Kawasaki, Tatsuya Hirose
Publikováno v:
28th European Microwave Conference, 1998.
We have developed novel hermetically sealed package with through-hole for the use in low-cost millimeter-wave applications. The package is available with specifications ranging from DC to 85 GHz. The insertion loss at feed-through of the package is l
Conference
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Publikováno v:
2006 European Microwave Integrated Circuits Conference; 2006, p233-236, 4p
Publikováno v:
2006 European Microwave Integrated Circuits Conference; 2006, p1-24, 24p
Publikováno v:
2006 European Microwave Integrated Circuits Conference; 2006, pnil1-nil166, 166p
Publikováno v:
2006 European Conference on Wireless Technology; 2006, pnil1-nil166, 166p
Autor:
Ohashi, Yoji, Shimura, Toshihiro, Kawasaki, Yoshihiro, Aoki, Shigenori, Someta, Hiroki, Shimura, Tadayuki, Hirose, Tatsuya, Aoki, Yoshio
Publikováno v:
1998 28th European Microwave Conference; 1998, Issue 2, p433-438, 6p
Publikováno v:
ETRI Journal; 2009, Vol. 31 Issue 3, p247-253, 7p, 2 Color Photographs, 3 Diagrams, 10 Graphs
Publikováno v:
IEEE MTT-S International Microwave Symposium Digest, 2003; 2003, p851-851, 1p