Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Tadatoshi Tomita"'
Autor:
K. Matsuzaki, Takeo Nakano, Tadatoshi Tomita, Takahiro Kitano, H. Genjima, Makoto Muramatsu, K. Yamamoto
Publikováno v:
SPIE Proceedings.
Placement of cylinders in hole multiplication patterns for directed self-assembly is the topic of this computational study. A hole doublet process applying a corner rounded rectangle guide is the focus of this work. Placements including morphology fl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3116df39874155e237ef80bb392ff85
https://doi.org/10.1117/12.2218596
https://doi.org/10.1117/12.2218596
Autor:
Koichi Yatsuda, Shinichiro Kawakami, Mark Somervell, Toshikatsu Tobana, Benjamen M. Rathsack, Doni Parnell, Makoto Muramatsu, Seiji Nagahara, Ainhoa Romo Negreira, Makiko Dojun, Soichiro Okada, Etsuo Iijima, Tadatoshi Tomita, Hiroyuki Iwaki, Takashi Yamauchi, Takeo Nakano, Takahiro Kitano, Kathleen Nafus, Vinayak Rastogi, Fumiko Iwao, Takanori Nishi, Jean-Luc Peyre
Publikováno v:
Advances in Patterning Materials and Processes XXXII.
Directed Self-Assembly (DSA) is being extensively evaluated for application in semiconductor process integration.1-7 Since 2011, the number of publications on DSA at SPIE has exploded from roughly 26 to well over 80, indicating the groundswell of int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c318fccc77119d31b1d67db788a0ca2d
https://doi.org/10.1117/12.2085776
https://doi.org/10.1117/12.2085776
Publikováno v:
Alternative Lithographic Technologies VII.
We report computational study for directed self-assembly (DSA) on morphologies’ dislocation caused by block copolymers’ (BCPs’) thermal fluctuation in grapho-epitaxial cylindrical guides. The dislocation factor expressed as DSA-oriented placeme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0aaab0489ca5405cff9d3be8074f481
https://doi.org/10.1117/12.2085084
https://doi.org/10.1117/12.2085084
Publikováno v:
SPIE Proceedings.
In this report, morphology of cylinders by block copolymer (BCP) in the corner rounded rectangle guide patterns is analyzed by simulation and compared with experimental results. In the case of the hole-multiplication, selection the guide pattern size
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b90ac699b8a8a95b77c23e3ada1e151
https://doi.org/10.1117/12.2045865
https://doi.org/10.1117/12.2045865
Autor:
Doni Parnell, Etsuo Iijima, Seiji Nagahara, Tadatoshi Tomita, Shinchiro Kawakami, Mark Somervell, Makiko Dojun, Takanori Nishi, Ainhoa Romo Negreira, Jean-Luc Peyre, Takeo Nakano, Koichi Yatsuda, Kathleen Nafus, Hiroyuki Iwaki, Mariko Ozawa, Takahiro Kitano, Takashi Yamauchi, Soichiro Okada, Takumi Ishiguro, Toshikatsu Tobana, Makoto Muramatsu, Benjamen M. Rathsack
Publikováno v:
SPIE Proceedings.
Directed Self-Assembly (DSA) is one of the most promising technologies for scaling feature sizes to 16 nm and below. Both line/space and hole patterns can be created with various block copolymer morphologies, and these materials allow for molecular-l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fea497ba427a444498027ca7b927d7d1
https://doi.org/10.1117/12.2045975
https://doi.org/10.1117/12.2045975
Autor:
Shinichiro Kawakami, Ali Mokhberi, Jason Sweis, Seiji Nagahara, Masami Aoki, Andrew Cross, Benjamen M. Rathsack, Tadatoshi Tomita, Hitoshi Kosugi, Takahiro Kitano, Makoto Muramatsu, Venkat Nagaswami, Ryota Harukawa
Publikováno v:
SPIE Proceedings.
This paper discusses the defect density detection and analysis methodology using advanced optical wafer inspection capability to enable accelerated development of a DSA process/process tools and the required inspection capability to monitor such a pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34ac50d7c4487154f2152257e6ff6e97
https://doi.org/10.1117/12.2011177
https://doi.org/10.1117/12.2011177
Autor:
Mikiya Muramatsu, K. Matsuzaki, Tadatoshi Tomita, M. Matsukuma, Takeo Nakano, Takahiro Kitano
Publikováno v:
Alternative Lithographic Technologies V.
We report morphology of cylinder of diblock copolymers (BCP), which consist of polymer A and B, in cylindrical prepattern holes by dissipative particle dynamics simulation in order to predict optimal cylinder profile. Configuration of cylinder which
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a49b510170d8344abae6d9ae69344e0
https://doi.org/10.1117/12.2011069
https://doi.org/10.1117/12.2011069
Publikováno v:
Advances in Resist Materials and Processing Technology XXVI.
Immersion lithography has been developed for 45nm technology node generation during the last several years. Currently, IC manufacturers are moving to high volume production using immersion lithography. Due to the demand of IC manufactures, as the cri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::351b40bae4f5359959e2e7a20a4d3ebe
https://doi.org/10.1117/12.814174
https://doi.org/10.1117/12.814174
Autor:
Mireia Blanco Mantecon, Tadatoshi Tomita, Kirsten Ruck, Hitoshi Kosugi, Richard Moerman, Shinichi Hatakeyama, Masashi Enomoto, Heiko Weichert, Casper Roderik De Groot, Kathleen Nafus, Shin Inoue, Raf Stegen
Publikováno v:
SPIE Proceedings.
In order to prepare for the next generation technology manufacturing, ASML and TEL are working together to investigate the process performance of the LITHIUSi+/ TWINSCAN XT:1700i lithocluster through decreasing critical dimension patterning. In this
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::060d41716c0253f3dc35efec5a0b84b9
https://doi.org/10.1117/12.712206
https://doi.org/10.1117/12.712206
Autor:
Takeshi Shimoaoki, Masashi Enomoto, Tadatoshi Tomita, Hideharu Kyoda, Toshifumi Suganaga, Junichi Kitano
Publikováno v:
SPIE Proceedings.
As a powerful candidate for a lithography technique that can accommodate the scaling-down of semiconductors, 193-nm immersion lithography-which realizes a high numerical aperture (NA) and uses deionized water as the medium between the lens and wafer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1c2c4b5bbe883f533f3434025160472
https://doi.org/10.1117/12.656441
https://doi.org/10.1117/12.656441