Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Tadatomo Yamada"'
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f7b544f2240f36c50696503806c3641
https://doi.org/10.23919/icep58572.2023.10129667
https://doi.org/10.23919/icep58572.2023.10129667
Publikováno v:
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ceffe1e22e416900dbefd3df4a71bb8
https://doi.org/10.1109/iemt55343.2022.9969504
https://doi.org/10.1109/iemt55343.2022.9969504
Publikováno v:
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Die attach material for LED package plays a significant role in performance and reliability of LED device. There are two common materials used for die attach in the LED package and each material has its own characteristics. Epoxy material which is we
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb65fb00d5152f60f7062a639c58258e
https://doi.org/10.1109/impact.2018.8625780
https://doi.org/10.1109/impact.2018.8625780
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Wafer Level Package (WLP) is a packaging technology focusing on IC packaging at wafer level instead of chip level. Conventional WLPs are designed for fan-in chip scale packaging but the shrinkage of pad pitch and size at the chip to package interface
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11231d0322fba250e41b8eb6c46c7cdb
https://doi.org/10.1109/ectc.2017.112
https://doi.org/10.1109/ectc.2017.112
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
The introduction of Chip Scale Package (CSP) has become one of the key packaging solutions in the recent semiconductor industry. With the advantages of reducing the package size and stacking capability for higher interconnects, CSP's are continuously
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55f1a20b2220206dbd6ca64bf0be0072
https://doi.org/10.1109/ectc.2017.76
https://doi.org/10.1109/ectc.2017.76