Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Tadakatsu Nakajima"'
Publikováno v:
Heat Transfer?Asian Research. 30:512-520
The cooling performance of a plate-fin-type heat sink equipped with a cooling fan was investigated experimentally. The heat sink was 80 mm long, 43 mm wide, and 24 mm in height (including the 4-mm-thick base). The cooling fan was 40 × 40 × 15 mm an
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 65:1377-1382
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 20:167-173
Convective boiling from small surfaces with submerged impingement of fluorocarbon liquid is investigated for high-performance cooling systems of electronic devices. The local heat transfer coefficients from silicon heaters in submerged impingement ar
Autor:
Tadakatsu Nakajima
Publikováno v:
Journal of the Japan Welding Society. 66:587-591
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 62:3406-3412
The device considered in this paper is a porous stud having microchannels running in three orthogonal directions, and was designed to enhance boiling heat transfer for liquid-cooled electronic components. The characteristics of boiling incipience at
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 61:2241-2247
The method of inverse-problem analysis was used to determine the distribution of heat-transfer coefficients of a silicon heater cooled with submerged jets of fluorocarbon liquid. The silicon heater was made specifically to investigate high-performanc
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 18:596-601
The purpose of this study is the enhancement of cooling of high heat flux power devices such as a thyristor by a thermosyphon system. The thermosyphon uses boiling and condensation of an inert dielectric fluorocarbon (FC-72). Boiling occurs from a mu
Publikováno v:
ASME/JSME 2011 8th Thermal Engineering Joint Conference.
We have developed a loop thermosyphon for cooling electronics devices. Its cooling performance changes with the ambient temperature and amount of input heating. Especially it deteriorates with non-condensable gas (NCG) increase. NCG leakage of thermo
Publikováno v:
Journal of Heat Transfer. 102:445-450
Enhancement of nucleate boiling heat transfer has been studied with the structured surfaces composed of interconnected internal cavities in the form of tunnels and small pores connecting the pool liquid and the tunnels. The boiling curves of R-11, wa
Publikováno v:
Journal of Heat Transfer. 104:286-291
The porous surface structure was manufactured with precision for the experimental study of nucleate boiling heat transfer in R-11. Boiling curves and the data of bubble formation were obtained with a variety of geometrical and operational parameters;