Zobrazeno 1 - 10
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pro vyhledávání: '"Ta-Chien Cheng"'
Autor:
Ta-Chien Cheng, 鄭達謙
103
From industrial revolution to the present, steel is the most popular applying alloy in the world. It has been developed for centuries, which could trace back to 1850s. However, the break-through development of steel just occurred in recent d
From industrial revolution to the present, steel is the most popular applying alloy in the world. It has been developed for centuries, which could trace back to 1850s. However, the break-through development of steel just occurred in recent d
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/77872779353734671795
Autor:
Ta-Chien Cheng, 鄭達謙
98
In this study, the high temperature mechanical properties of thermal mechanical treated commercial ZK60 alloy were investigated. The research is performed at 200℃ and 300℃ to understand its high temperature mechanical properties. Thermal
In this study, the high temperature mechanical properties of thermal mechanical treated commercial ZK60 alloy were investigated. The research is performed at 200℃ and 300℃ to understand its high temperature mechanical properties. Thermal
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/03179692519506188397
Publikováno v:
Key Engineering Materials. 732:55-58
The purpose of this investigation is focused on the direct quench and temper mechanisms of the high strength offshore steel. Microstructural analyses of martensite and retained austenite in the direct quenched steel, simulations of martensitic transf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c31b61734980509631330ef96d674f5
https://doi.org/10.4028/www.scientific.net/kem.732.55
https://doi.org/10.4028/www.scientific.net/kem.732.55
Autor:
Simone Capecchi, Frank Kuechenmeister, Bjoem Boehme, Christian Goetze, Ta-Chien Cheng, Dirk Breuer, Maricel Sy
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
This paper summarizes the work which was done to understand the die warpage at different temperatures and the influence on the assembly yield in a FCCSP package in combination with Cu pillar first level interconnects. A Cu BEoL stack with two ultra-t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::610c2be5be438e265f41c66f05abe1a3
https://doi.org/10.23919/empc44848.2019.8951758
https://doi.org/10.23919/empc44848.2019.8951758
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
There is growing demand for wafer level packaging, which enables thinner, lighter, and more cost effective packaging solutions. However, these demands come with a penalty; reduced package footprint limits the number of I/Os that can be realized in th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69eac8e172aa12aa3206e8e6f9abd723
https://doi.org/10.1109/ectc.2019.00142
https://doi.org/10.1109/ectc.2019.00142
Autor:
Earl Gow, Kangho Lee, Lim Wei Yi, Ta-Chien Cheng, Eva Wai Leong Ching, Lim Teck Guan, Jason Janesky
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
A magnetic shield was developed for the standard BGA MRAM DDRS chip to increase the magnetic interference tolerance from 100}}oe to more than 500 oetextbf{{. This enabled the low power and fast speed MRAM devices to operate in more rugged conditions.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c803d7167f2c043d2880f8d550eadc6a
https://doi.org/10.1109/eptc.2018.8654329
https://doi.org/10.1109/eptc.2018.8654329
Publikováno v:
Materials Research Innovations. 19:S9-69
The ductile-to-brittle transition of direct quenched and tempered martensite begins at 243 K, and the impact energy of the superficial region of the steel plate decreases from 104 J (243 K) to 50 J (213 K). In contrast, the ductile-to-brittle transit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e04e76409cba9885ea57011c35aa4a93
https://doi.org/10.1179/1432891715z.0000000001922
https://doi.org/10.1179/1432891715z.0000000001922
Publikováno v:
Advanced Materials Research. 1101:438-441
The purpose of this investigation is focused on the welding process simulation using the SYSWELD software. It has been used to conduct the simulation of the tungsten inert gas (TIG) welding process. 316L stainless steel (316L SS) is welded with a low
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2dffb817961c0b318870d1607b85e299
https://doi.org/10.4028/www.scientific.net/amr.1101.438
https://doi.org/10.4028/www.scientific.net/amr.1101.438
Publikováno v:
Advanced Materials Research. 936:1312-1316
The purpose of this investigation is focused on two high strength low alloy steels for offshore application. TTT, CCT curves, Vickers depth profiles and microstructures of direct water quenched steels are evaluated in the experiment. Microhardness of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d62496aefebed9af9d291585c25385cf
https://doi.org/10.4028/www.scientific.net/amr.936.1312
https://doi.org/10.4028/www.scientific.net/amr.936.1312
Publikováno v:
Journal of Alloys and Compounds. 577:S338-S343
The effects of slight Tantalum (Ta) addition on the microstructures, martensitic transformation and pseudoelasticity of Fe–28Mn–6Si–5Cr alloy were investigated. Experimental results show that the slight addition of 0.1 wt% Ta can effectively in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66519b67051932f746467a963aac36af
https://doi.org/10.1016/j.jallcom.2012.02.029
https://doi.org/10.1016/j.jallcom.2012.02.029