Zobrazeno 1 - 10
of 4 725
pro vyhledávání: '"TSV"'
Publikováno v:
Energy and Built Environment, Vol 5, Iss 4, Pp 556-567 (2024)
Electric vehicle (EV) is more environmental-friendly than gasoline vehicle because the main power is not petrol. For the heating system, the waste heat generated by engines is recycled to heat the cabin of gasoline ones, while the EV need extra elect
Externí odkaz:
https://doaj.org/article/dedf227c7d454003802ac7a0e42f93e4
Autor:
Binbin Jiao, Jingping Qiao, Shiqi Jia, Ruiwen Liu, Xueyong Wei, Shichang Yun, Yanmei Kong, Yuxin Ye, Xiangbin Du, Lihang Yu, Bo Cong
Publikováno v:
Engineering, Vol 38, Iss , Pp 201-208 (2024)
In three-dimensional (3D) stacking, the thermal stress of through-silicon via (TSV) has a significant influence on chip performance and reliability, and this problem is exacerbated in high-density TSV arrays. In this study, a novel hollow tungsten TS
Externí odkaz:
https://doaj.org/article/207a6a51b9ad4f67a1e674105750a6ea
Publikováno v:
Journal of Materials Research and Technology, Vol 31, Iss , Pp 679-688 (2024)
Through Silicon Vias (TSV) are crucial in semiconductor technology for vertically connecting multiple stacks in 3D packaging. High aspect ratio, smooth and slightly tapered TSVs enhance layout efficiency and void-free filling. Being contact-less and
Externí odkaz:
https://doaj.org/article/18481c406e004090bcb845f067e7f280
Publikováno v:
Case Studies in Thermal Engineering, Vol 63, Iss , Pp 105253- (2024)
The thermal environment is closely related to emotion. The thermal environment affects emotional experiences and can enhance them by adjusting its parameters. This study examines three common negative emotions—boredom, anxiety, and irritability—i
Externí odkaz:
https://doaj.org/article/9b0d54661a1240ad9352dad474b756fd
Autor:
Arjun Moothedath, Zhong Ren
Publikováno v:
Micro and Nano Engineering, Vol 25, Iss , Pp 100288- (2024)
This study explores the development and characterization of plasma etching for sub-micron features using a nonlinear evolution of parameter in a three-step cyclic Bosch process. Comparing this nonlinear approach with traditional linear parameter evol
Externí odkaz:
https://doaj.org/article/c0fec81996d14d5aaba495f04fafaeb5
Akademický článek
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Autor:
Muhammad Tarique Lakhiar, Shalini Sanmargaraja, AbdulLateef Olanrewaju, Chong Hooi Lim, Vignes Ponniah, Anselm Dass Mathalamuthu
Publikováno v:
Case Studies in Thermal Engineering, Vol 60, Iss , Pp 104614- (2024)
This study examined thermal comfort in a sustainable office building in Malaysia, with the goal of understanding how objective environmental data relates to occupants' subjective experiences. The study utilized established thermal comfort models, suc
Externí odkaz:
https://doaj.org/article/537741e946ab42d89cc8300bfe735081
Autor:
Pratik Kar, Rachita Ruchismita Sarangi, Durgesh Prasad Bagarty, Prakash Kumar Ray, Asit Mohanty, Manzoore Elahi M. Soudagar, Yasser Fouad, Sagar Shelare
Publikováno v:
IEEE Access, Vol 12, Pp 124658-124680 (2024)
This multilevel inverter produces a multi-stepped output voltage based on series connection of power cells making the use of standard low voltage components. The proposed topology uses only one voltage source and with combination of capacitors and is
Externí odkaz:
https://doaj.org/article/800a2bdedf7f4393977ce57b6e9eda4b
Akademický článek
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Publikováno v:
Journal of Materials Research and Technology, Vol 25, Iss , Pp 3712-3727 (2023)
Through-Silicon Vias (TSV) play an important role in the field of semiconductor 3D packaging by providing interconnections during layer-by-layer stacking. Laser machining of TSVs is advantageous over expensive photolithography steps in the DRIE proce
Externí odkaz:
https://doaj.org/article/31a24eeeeece484a90801280a4ef7e20