Zobrazeno 1 - 10
of 231
pro vyhledávání: '"THOMAS D. MOORE"'
Publikováno v:
Journal of Urology. 199
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15f290a4edccdc54230acb5e88948668
https://doi.org/10.1016/j.juro.2018.02.3036
https://doi.org/10.1016/j.juro.2018.02.3036
Publikováno v:
In The Journal of Urology April 2018 199(4) Supplement:e1246-e1247
Akademický článek
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Autor:
Thomas D. Moore
Publikováno v:
International Journal of Solids and Structures. 42:271-285
The purpose of this paper is to present a solution for the peeling moment arising from the peeling stress distribution in any interface in a multilayer beam or plate. The solution is implemented for three- and four- layer beams; it is shown that it c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c368efc903fc9b050e05ca3158c3c34
https://doi.org/10.1016/j.ijsolstr.2004.07.013
https://doi.org/10.1016/j.ijsolstr.2004.07.013
Autor:
Thomas D. Moore, John L. Jarvis
Publikováno v:
Journal of Electronic Packaging. 126:106-109
The peeling stress near the free edge of a bimaterial beam under uniform temperature change creates a moment which causes both layers to have identical curvatures at the interface. A new formula from beam theory is given for this Peeling Moment. A be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f40a3c4456628ba51eb0b7cba44cdbb2
https://doi.org/10.1115/1.1649240
https://doi.org/10.1115/1.1649240
Autor:
John L. Jarvis, Thomas D. Moore
Publikováno v:
Microelectronics Reliability. 43:487-494
The determination of the peeling stress in the interface between the two layers of a bimaterial structure has long been of particular interest in the microelectronic industry. This is because peeling of deposited layers on silicon wafers, and delamin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a8a9b14431a3e9bd1b1b011148bf850
https://doi.org/10.1016/s0026-2714(02)00317-7
https://doi.org/10.1016/s0026-2714(02)00317-7
Autor:
John L. Jarvis, Thomas D. Moore
Publikováno v:
Microelectronics Reliability. 43:155-162
This paper examines thermomechanical warpage in a bimaterial plate. It considers the suitability of axisymmetric and generalized plane strain finite element analyses, and it compares these to the 3-D analysis of a bimaterial plate in which properties
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f362d1a58119892088a369ec025d54ed
https://doi.org/10.1016/s0026-2714(02)00123-3
https://doi.org/10.1016/s0026-2714(02)00123-3
Autor:
John L. Jarvis, Thomas D. Moore
Publikováno v:
Microelectronics Reliability. 42:943-949
It has long been recognized that the properties of printed circuit boards and BGA laminates in the out-of-substrate direction differ greatly from the properties in the plane of the substrate. In this paper the variation of in-substrate-plane properti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc7eb37b2020faff91164621f174e8de
https://doi.org/10.1016/s0026-2714(02)00010-0
https://doi.org/10.1016/s0026-2714(02)00010-0
Autor:
John L. Jarvis, Thomas D. Moore
Publikováno v:
Microelectronics Reliability. 41:461-469
The subject of this paper is a 14×22 mm ball grid array (BGA) integrated circuit assembly containing two or three chips. Three failure modes came to light in the reliability testing of this BGA package: delamination of solder resist from the top cop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4197b6d831206b8f698fc69fd483b127
https://doi.org/10.1016/s0026-2714(00)00230-4
https://doi.org/10.1016/s0026-2714(00)00230-4
Autor:
Thomas D. Moore, John L. Jarvis
Publikováno v:
Journal of Applied Mechanics. 71:290-292
Two-layer beams (i.e., bimaterials) under thermomechanical stress are prone to peeling or delamination at the free edges. The self-equilibrating peeling stress gives rise to a peeling moment Mp close to the free ends. A simple and exact formula for M
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14be3a6c821164f9e672d8db5f875c04
https://doi.org/10.1115/1.1651092
https://doi.org/10.1115/1.1651092