Zobrazeno 1 - 10
of 155
pro vyhledávání: '"THICK-film circuits"'
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology. May2018, Vol. 8 Issue 5, p773-783. 11p.
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology. May2018, Vol. 8 Issue 5, p784-791. 8p.
Publikováno v:
Journal of Applied Physics. 10/15/2002, Vol. 92 Issue 8, p4705. 7p. 6 Black and White Photographs, 1 Chart.
Autor:
Löffler, Sebastian1 sebastian.loeffler@cicor.com, Mauermann, Christopher1 christopher.mauermann@cicor.com, Rebs, Angela1 angela.rebs@cicor.com, Reppe, Günter1 guenter.reppe@cicor.com
Publikováno v:
Microelectronics International. 2018, Vol. 35 Issue 3, p158-163. 6p.
High Performance Compact Multilayer Circular Spiral Inductors in Advanced Photoimageable Technology.
Autor:
Samanta, Kamal K.1, Robertson, Ian D.2
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology. Dec2014, Vol. 4 Issue 12, p1981-1988. 8p.
Autor:
Kandpal, Kavindra1 kavindra.kandpal@pilani.bits-pilani.ac.in, Gupta, Navneet1 ngupta@pilani.bits-pilani.ac.in
Publikováno v:
Microelectronics International. 2018, Vol. 35 Issue 1, p52-63. 12p.
Autor:
Lim, Wei Qiang1,2 richiewq90@hotmail.com, Devarajan, Mutharasu1,2 mutharasu@usm.my, Subramani, Shanmugan1,2 shanmugan@usm.my
Publikováno v:
Microelectronics International. 2018, Vol. 35 Issue 1, p33-44. 12p.
Publikováno v:
IEEE Transactions on Components & Packaging Technologies. Mar1999, Vol. 22 Issue 1, p120. 6p. 3 Black and White Photographs, 1 Diagram, 7 Graphs.
Autor:
Kamble, Pradeep1, Puri, Vijaya1 vrpphy@unishivaji.ac.in
Publikováno v:
International Journal of Electronics. Jul2010, Vol. 97 Issue 7, p857-865. 9p. 1 Diagram, 2 Charts, 4 Graphs.