Zobrazeno 1 - 5
of 5
pro vyhledávání: '"TADAHIKO SAKAI"'
Autor:
Tadahiko Sakai
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 17:418-421
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::990a7c5374da9509b5581cf3c46fbf4f
https://doi.org/10.5104/jiep.17.418
https://doi.org/10.5104/jiep.17.418
Autor:
Koji Motomura, Seiichi Yoshinaga, Tadahiko Sakai, Yoshiyuki Wada, Tsubasa Saeki, Shoji Sakemi
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 14:367-371
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b0f66d56f1b1ea68b31eeeb11ac3cdf
https://doi.org/10.5104/jiep.14.367
https://doi.org/10.5104/jiep.14.367
Autor:
JUN-ICHI FUKUDA, RITSUO TAKAGI, MASATAKA KAJI, YUKIO HATTORI, TAKUMI KAWATA, TADAHIKO SAKAI, HIROYUKI NOMURA, KOUJI HANADA, YUUICHI MUTOH
Publikováno v:
The Japanese Journal of Jaw Deformities. 10:11-17
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8d26623b0d81994a41451b328517841
https://doi.org/10.5927/jjjd1991.10.11
https://doi.org/10.5927/jjjd1991.10.11
Autor:
TADAHIKO SAKAI, RITSUO TAKAGI, MASATAKA KAJI, JUN-ICHI FUKUDA, YUKIO HATTORI, TAKUMI KAWATA, HIROYUKI NOMURA
Publikováno v:
The Japanese Journal of Jaw Deformities. 10:134-138
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f48519bf1dc40996948cefb94af546cc
https://doi.org/10.5927/jjjd1991.10.134
https://doi.org/10.5927/jjjd1991.10.134
Publikováno v:
2012 2nd IEEE CPMT Symposium Japan.
In this report, authors describe improvement effort of fine pitch flip-chip interconnection based on pre-applied material process. For evaluation, IC with copper pillar bumps (50 μm pitch) and organic boards (FR-5) have been used. NCF and B-stage ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75ddec37968604613a3f059e155b895e
https://doi.org/10.1109/icsj.2012.6523392
https://doi.org/10.1109/icsj.2012.6523392