Zobrazeno 1 - 10
of 92
pro vyhledávání: '"T.M. Korhonen"'
Autor:
Paul A. Lauro, Sung K. Kang, L.P. Lehman, Karl J. Puttlitz, T.M. Korhonen, David E. King, Charles C. Goldsmith, James John Woods, Da-Yuan Shih, Matt A. Korhonen, Jay Bartelo, Donald W. Henderson, Eric J. Cotts, Timothy A. Gosselin
Publikováno v:
Journal of Materials Research. 19:1608-1612
During the solidification of solder joints composed of near-eutectic Sn–Ag–Cu alloys, the Sn phase grows rapidly with a dendritic growth morphology, characterized by copious branching. Notwithstanding the complicated Sn growth topology, the Sn ph
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb007cb82be0f5d71a9ffe1d03f64500
https://doi.org/10.1557/jmr.2004.0222
https://doi.org/10.1557/jmr.2004.0222
Publikováno v:
Microelectronics Reliability. 40:2053-2060
Reliability assessment of chip level interconnects is based on accelerated testing at a higher temperature and a larger current density than expected in service conditions. The critical parameters needed to extrapolate accelerated test data to servic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d3b794afa6e64736e8e30c243010639
https://doi.org/10.1016/s0026-2714(00)00193-1
https://doi.org/10.1016/s0026-2714(00)00193-1
Publikováno v:
1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).
Reliability assessment of chip level interconnects is based on accelerated testing at a higher temperature and a larger current density than expected in service conditions. The critical parameters needed to extrapolate accelerated test data to servic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b5dc9513d1dd586b008dac912cd877b
https://doi.org/10.1109/relphy.1999.761617
https://doi.org/10.1109/relphy.1999.761617
Publikováno v:
1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105).
Although current density exponents and activation energies are well-known for the elemental processes (like void nucleation due to electromigration generated stress) there is no consensus on which apparent activation energy or current density exponen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6d0591d6539a3288aad79ef44427902
https://doi.org/10.1109/icsict.1998.785857
https://doi.org/10.1109/icsict.1998.785857
Publikováno v:
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
Direct Chip Attach (DCA) of Si chips to an organic substrate requires modification to the conventional Cu based Under Bump Metallization (UBM). Ni-containing UBM's have proven to be able to effectively reduce the intermetallic compound growth rate, w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4afe509fe71bc7c279438ddf0b9c6983
https://doi.org/10.1109/ectc.2000.853451
https://doi.org/10.1109/ectc.2000.853451
Autor:
Caffarelli, Carlo1 (AUTHOR) carlo.caffarelli@unipr.it, Gracci, Serena2 (AUTHOR), Giannì, Giuliana1 (AUTHOR), Bernardini, Roberto2 (AUTHOR)
Publikováno v:
Journal of Clinical Medicine. Aug2023, Vol. 12 Issue 16, p5400. 16p.
Autor:
Ljubin-Sternak, Sunčanica1,2 (AUTHOR) sljsternak@stampar.hr, Meštrović, Tomislav3,4 (AUTHOR) tmestrovic@unin.hr
Publikováno v:
Viruses (1999-4915). Apr2023, Vol. 15 Issue 4, p825. 14p.
Publikováno v:
Scopus-Elsevier
Several under bump metallization (UBM) schemes using CuNi alloys as the solderable layer were investigated. The nickel slows down the dissolution of the UBM into the solder and the formation of intermetallics during reflow. Ni containing UBMs were fa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::568f720a3f8c29bc03a1f638c30ef61e
http://www.scopus.com/inward/record.url?eid=2-s2.0-0034478827&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-0034478827&partnerID=MN8TOARS
Autor:
Akkara, Francy John1 (AUTHOR), Hamasha, Sa'd1 (AUTHOR) smh0083@auburn.edu, Alahmer, Ali1,2 (AUTHOR), Evans, John1 (AUTHOR), Belhadi, Mohamed El Amine1 (AUTHOR), Wei, Xin1 (AUTHOR)
Publikováno v:
Materials (1996-1944). Oct2022, Vol. 15 Issue 19, p6759. 22p.
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.