Zobrazeno 1 - 10
of 78
pro vyhledávání: '"T.H. Hou"'
Autor:
J.H. Lee, C.H. Chou, P.J. Liao, Y.K. Chang, H.H. Huang, T.Y. Lin, Y.S. Liu, C.H. Nien, D.H. Hou, T.H. Hou, Jun He
Publikováno v:
2022 International Electron Devices Meeting (IEDM).
Akademický článek
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Autor:
G.A. Knight, Frank L. Palmieri, John W. Connell, Marcus A. Belcher, T.H. Hou, Christopher J. Wohl
Publikováno v:
International Journal of Adhesion and Adhesives. 39:1-7
Fiber reinforced resin matrix composites and structural adhesives have found increased usage on commercial and military aircraft. These structural materials offer weight savings without sacrificing strength and mechanical performance. Since service h
Autor:
T.H. Hou, B.J. Jensen
Publikováno v:
Polymer Composites. 29:906-914
A nonautoclave vacuum bag process using atmospheric pressure alone that eliminates the need for external pressure supplied normally by an autoclave or a press is an attractive method for composite fabrication. This type of process does not require la
Autor:
C.C. Zhang, T.H. Hou, M. Micusik, W.L. Lai, M. Omastova, Boris Hudec, Peter Jančovič, I.T. Wang, Karol Fröhlich
Publikováno v:
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials.
Publikováno v:
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials.
Publikováno v:
2008 IEEE International Conference on Industrial Engineering and Engineering Management.
Social intelligence plays an important role in multiple-intelligence. There is limited research about social intelligence evaluation in Taiwan. The goal of the present study was to adapt the Tromso Social Intelligence Scale (TSIS) to the digital libr
Autor:
H.T. Huang, H.L. Sun, S. Chen, A. Chen, H.M. Jao, D. C. Wilusz, J.Y. Pan, T.H. Hou, S. Ramamurthy, E. Chiao
Publikováno v:
9th International Conference on Advanced Thermal Processing of Semiconductors, RTP 2001.
This paper characterizes the performance of the Applied Materials 200 mm Radiance/spl trade/ Centura for 0.13 /spl mu/m ultra-shallow junction (USJ) applications. The Radiance spike anneal process is distinguished by fast ramp-up (250/spl deg/C/sec)
Akademický článek
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Autor:
T.H. Hou
Publikováno v:
Powder Technology. 41:99-104
For materials with broad size distributions, it is recognized that the small fractions of the large-size particles are few in population counts. However, these particles represent a major fraction in the total solid weight. The small errors in number