Zobrazeno 1 - 10
of 440
pro vyhledávání: '"T.-J. King"'
Autor:
H.-S. P. Wong, K. Akarvardar, D. Antoniadis, J. Bokor, C. Hu, T.-J. King-Liu, S. Mitra, J.D. Plummer, S. Salahuddin, L. Deng, G. Li, S. Han, L. Shi, Y. Xie, E. Yaacoub, M.-S. Alouini, A. Douik, H. Dahrouj, T.Y. Al-Naffouri
Publikováno v:
Proceedings of the IEEE. 108:483-484
Autor:
M. Vinet, Louis Hutin, Giulia Usai, Thomas Ernst, J. L. Munoz-Gamarra, T. J. King Liu, Urmita Sikder
Publikováno v:
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
This work provides guidelines aiming at obtaining a functional, non-volatile and reprogrammable NEM relay design for ultra-low power hybrid NEMS/CMOS circuits addressing various non-volatile memory applications operating at a fixed supply voltage Vdd
Publikováno v:
Experimental physiology. 102(6)
What is the central question of this study? The aim was to establish the ability of a newly designed leg exercise technique to produce sustained elevations in shear rate that stimulate flow-mediated dilatation (FMD) in the superficial femoral artery
Publikováno v:
14th IEEE International Conference on Nanotechnology.
Autor:
T. J. King
Publikováno v:
BT Technology Journal. 16:9-15
This paper highlights the current approach to large-scale internetwork design using today‘s network layer routeing protocols. It describes how large internetworks can be constructed to provide stability, resilience and scalability, together with a
Autor:
T. J. King
Publikováno v:
Journal of Bryology. 25:211-213
Autor:
N.W. Cody, A. Yiptong, Xiangyang Huang, Robert J. Mears, M. Hytha, R.J. Stephenson, T.-J. King-Liu, Hideki Takeuchi, Nuo Xu, Nattapol Damrongplasit
Publikováno v:
2012 IEEE Silicon Nanoelectronics Workshop (SNW).
We demonstrate simultaneous NMOS and PMOS high-field mobility enhancement and variability reduction by inserting partial monolayers of oxygen during silicon epitaxy of the channel layer.
Publikováno v:
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS).
A low-thermal-budget (CMOS-compatible) process for microshell encapsulation of MEMS devices is proposed. Inkjet-printing of silver (Ag) nanoparticle ink is demonstrated to form porous microshells through which sacrificial oxide (SiO2) can be selectiv
Autor:
T. J. King Liu
Publikováno v:
Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials.
Publikováno v:
Journal of the Chemical Society.