Zobrazeno 1 - 10
of 84
pro vyhledávání: '"T. Uhrmann"'
Autor:
B. Dielacher, S. Schmolzer, T. Matthias, B. Povazay, F. Bogelsack, R. Holly, T. Zenger, T. Uhrmann, B. Thallner
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Publikováno v:
2020 International Wafer Level Packaging Conference (IWLPC).
Moving from monolithic scaling to the second (2D) and to the third dimension (3D) is becoming increasingly important within industry. In the last years heterogeneous and chiplet integration, utilizing advanced packaging technologies, has increased in
Autor:
Paul Lindner, Elisabeth Brandl, Harald Wiesbauer, Markus Wimplinger, Martin Eibelhuber, Thomas Uhrmann, Julian Bravin, T. Uhrmann
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-21
In recent years temporary bonding has evolved to a widely used process technology as it is an enabling process for many products relyinnovel solutions are typically assessed on two key criteria which are a broad process window and cost effectiveness.
Autor:
J. Rimbock, Y. Taguchi, Tobias Zenger, R. Holly, M. Weinhart, M. Brunnbauer, Martin Eibelhuber, H. Taguchi, T. Uhrmann, B. Matuskova
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
CMOS image sensors technology is nowadays widely used in various applications due to multiple advantages, such as low cost, low power consumption, on chip functionality, high-speed of operation [1]. The market for CMOS image sensor (CIS) technology i
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Adhesive bonding using an ultra-thin polymer layer is getting more attention for more than Moore applications. However some challenges of ultra-thin layer coating remain and are subject to further research. For this purpose diluted BCB adhesive layer
Autor:
H. Brückl, T. Uhrmann, M. Rührig, L. Bär, Amit Kohn, U Paschen, S Weyers, Theodoros Dimopoulos, Vlado K. Lazarov
In this work we present the structural and electrical characterization of sputter-deposited CoFe(B)/MgO/Si metal-insulator-semiconductor tunneling junctions for injection and detection of spin polarized current in silicon. The multilayers have been d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7c395273e3fed8909804b4b7949de885
https://doi.org/10.1063/1.2891503
https://doi.org/10.1063/1.2891503
Autor:
T. Uhrmann, Daniel Schwarz, U Paschen, Theodoros Dimopoulos, Amit Kohn, Daniel Kirk, H. Brückl, S Weyers
We investigate the magnetic properties of arrays of sputter-deposited, Co70Fe30/Ni80Fe20 and Co40Fe40B20 contacts to silicon, embedded into 42 nm thick SiO2 dielectric. The contacts have rectangular shapes with blunt edges, sub-micrometre width and d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b0b958b2504d7fa2cdd0cafdc65c516f
https://doi.org/10.1088/0022-3727/42/8/085004
https://doi.org/10.1088/0022-3727/42/8/085004
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Autor:
M. Kast, Theodoros Dimopoulos, C. Stepper, Jörg Schotter, N. Wiese, H. Brückl, Rudolf Heer, T. Uhrmann
Publikováno v:
Journal of Magnetism and Magnetic Materials. 316:e948-e952
In this work we study the magnetic properties of 4-nm-thick permalloy films deposited into flat elliptical holes with an aspect ratio of 2:1 and short axis ranging from 2000 down to 70 nm. The holes are patterned into 50- and 200-nm-thick SiO 2 diele
Publikováno v:
SPIE Proceedings.
Nanoimprinting techniques are an attractive solution for next generation lithography methods for several areas including photonic devices. A variety of potential applications have been demonstrated using nanoimprint lithography (NIL) (e.g. SAW device