Overcoming the Data Deluge Challenges with Greener Electronics

Autor: J.-R. Lequepeys, Thomas Ernst, Alexandre Valentian, S. Catrou, L. Herault, T. Signamarcheix, D. Louis, Elisa Vianello, R. Fournel, S. Bonnetier, F. Perruchot, C. Reita, A. Jerraya, M. Duranton

Publikováno v: ESSCIRC
ESSCIRC 2021-IEEE 47th European Solid State Circuits Conference (ESSCIRC)
ESSCIRC 2021-IEEE 47th European Solid State Circuits Conference (ESSCIRC), Sep 2021, Grenoble, France. pp.7-14, ⟨10.1109/ESSCIRC53450.2021.9567836⟩

The complete ecosystem of electronic device manufacturers, from microelectronics, software and hardware designers to developers, producers, and integrators, is facing an immense new environmental challenge: to cope with the data deluge and to reduce

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7f481a62ad851d625170bfdf4411a539
https://doi.org/10.1109/esscirc53450.2021.9567836

Fully depleted silicon on insulator MOSFETs on (110) surface for hybrid orientation technologies

Autor: B. Ghyselen, Emmanuel Nolot, Laurent Clavelier, O. Faynot, B. Biasse, T. Signamarcheix, Francois Andrieu, M. Casse, A.M. Papon

Publikováno v: Solid-State Electronics

An alternative technology is studied here to elaborate hybrid orientation silicon on insulator (SOI) films above a continuous buried oxide (BOX). To this purpose, a “deep-amorphization” followed by solid phase epitaxial regrowth (SPER) of SOI fil

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::10c1a895fcd747cb4417c0ccff3d2418
https://doi.org/10.1016/j.sse.2011.01.013

First Demonstration of 300mm InGaAs-On-Insulator Substrates Fabricated using the Smart CutTM Technology

Autor: M. Martin, E. Beche, C. Veytizou, S. Sollier, G. Gaudin, S. Arnaud, S. David, D. Delprat, A. Salaun, T. Baron, T. Signamarcheix, J. Widiez, Frederic Mazen, F. Madeira, Sylvie Favier, Helen Grampeix

Publikováno v: Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::228302747c05ff27c2345cbb847aae52
https://doi.org/10.7567/ssdm.2015.n-5-3

LiTaO3/Silicon Composite Wafers for the Fabrication of Low Loss Low TCF High Coupling Resonators for Filter Applications

Autor: W. Daniau, J.-B. Moulet, S. Ballandras, E. Courjon, Thierry Baron, T. Signamarcheix

Publikováno v: Physics Procedia
Physics Procedia, 2015, 70, pp.1007-1011
Physics Procedia, 2015, 2015 ICU International Congress on Ultrasonics May 2015 Metz, 70, pp.1007-1011. ⟨10.1016/j.phpro.2015.08.210⟩

International audience; SAW devices are widely used for radio-frequency (RF) telecommunication filtering and the number of SAW filters, resonators or duplexers is still increasing in RF stage of cellular phones. Therefore, a strong effort is still de

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::509caee3c8ba2ba37c30b7b23449226f
https://hal.archives-ouvertes.fr/hal-02993743

Quartz-based vibrating MEMS fabricated using a wafer-bonding process with sealed cavities

Autor: P. Lavenus, T. Signamarcheix, Rachid Taibi, Sylvain Ballandras, Lamine Benaissa, Emmanuel Augendre, Olivier Le Traon, Sebastien Grousset

Publikováno v: 2014 IEEE International Frequency Control Symposium (FCS).

Here we present the results of a wafer-level approach allowing the collective fabrication of gyroscope sensors based on quartz vibrating MEMS. More specifically, we focus on suspended quartz tuning fork microstructures of a desired thickness over con

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::e4c7113318610870410eefe0a1523f2f
https://doi.org/10.1109/fcs.2014.6859861