Zobrazeno 1 - 10
of 420
pro vyhledávání: '"T. S. J. Lammerink"'
Publikováno v:
41st International Conference on Micro-and Nano-Engineering, MNE 2015
This paper presents a technique for measuring the ratio between two on-chip capacitances which largely eliminates the influence of drift in the electronic measurement circuit. Measurement results on an inline capacitive pressure sensor are presented.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8b1bfb6c67df9a14794959b6168ab031
https://research.utwente.nl/en/publications/b2bcc234-6fd1-4eed-af3d-c41c60d6de0f
https://research.utwente.nl/en/publications/b2bcc234-6fd1-4eed-af3d-c41c60d6de0f
Publikováno v:
Proceedings SENSOR 2011.
Autor:
Todorovic, D. M.
Publikováno v:
Journal of Applied Physics; 9/7/2023, Vol. 134 Issue 9, p1-13, 13p
Autor:
R A Brookhuis, R G P Sanders, K Ma, T S J Lammerink, M J de Boer, G J M Krijnen, R J Wiegerink
Publikováno v:
Journal of Micromechanics & Microengineering; Feb2015, Vol. 25 Issue 2, p1-1, 1p
Autor:
Zhong, Bowen1,2 (AUTHOR), Jiang, Kai3 (AUTHOR), Wang, Lili1,2 (AUTHOR) liliwang@semi.ac.cn, Shen, Guozhen1,2 (AUTHOR) gzshen@semi.ac.cn
Publikováno v:
Advanced Science. 1/5/2022, Vol. 9 Issue 1, p1-27. 27p.
Publikováno v:
Journal of Micromechanics & Microengineering; Jul2005, Vol. 15 Issue 7, pS132-S138, 1p
Publikováno v:
Advanced Materials Interfaces; Jan2024, Vol. 11 Issue 1, p1-13, 13p
Autor:
Papamatthaiou, Sotirios, Boxall-Clasby, James, Douglas, Edward J. A., Jajesniak, Pawel, Peyret, Hadrien, Mercer-Chalmers, June, Kumar, Varun K. S., Lomonossoff, George P., Reboud, Julien, Laabei, Maisem, Cooper, Jonathan M., Kasprzyk-Hordern, Barbara, Moschou, Despina
Publikováno v:
Lab on a Chip; 10/21/2023, Vol. 23 Issue 20, p4400-4412, 13p
Autor:
Gong, Zheng, Cao, Yudong, Cao, Hongchao, Wan, Bowei, Yang, Zhen, Ke, Xin, Zhang, Deyuan, Chen, Huawei, Wang, Kaijie, Jiang, Yonggang
Publikováno v:
Advanced Intelligent Systems (2640-4567); Oct2023, Vol. 5 Issue 10, p1-16, 16p
Publikováno v:
Lab on a Chip; 8/7/2023, Vol. 23 Issue 15, p3311-3327, 17p