Zobrazeno 1 - 10
of 40
pro vyhledávání: '"T. S. Eagleton"'
Publikováno v:
Transactions of the IMF. 85:34-39
Electrodeposition allows the surface properties of a material to differ from the bulk. The use of binary alloys can greatly increase the range of applications that can be achieved with the deposition of pure metals. In this study the deposition of ni
Autor:
T. S. Eagleton, J. P. G. Farr
Publikováno v:
Transactions of the IMF. 80:9-12
Co layers 25, 50 and 100 nm thick have been electrodeposited onto polycrystalline Cu. The development of the crystal structure of the layers has been examined using crystal orientation mapping (COM) and related to that of the underlying Cu. The magne
Publikováno v:
Transactions of the IMF. 78:61-64
SUMMARYThe orientation of the substrate used in electrodeposition has a significant effect on the distribution and morphology of the deposit. This may be particularly important in producing multilayered structures with a short repeat distance.It has
Autor:
PLAIPAITĖ-NALIVAIKO, R.1 rita.plaipaite-nalivaiko@ktu.lt, GRIŠKONIS, E.2, ADLIENĖ, D.3, GILYS, L.3
Publikováno v:
Acta Physica Polonica: A. Aug2019, Vol. 136 Issue 2, p267-273. 7p.
Autor:
Thedford, R. Paxton, Yu, Fei, Tait, William R. T., Shastri, Kunal, Monticone, Francesco, Wiesner, Ulrich
Publikováno v:
Advanced Materials; 2/2/2023, Vol. 35 Issue 5, p1-28, 28p
Publikováno v:
Journal of Applied Physics; Apr2009, Vol. 105 Issue 8, p084306-084310, 4p, 2 Black and White Photographs, 2 Charts, 4 Graphs
Publikováno v:
Journal of Applied Physics; 6/1/2005, Vol. 97 Issue 11, p113908, 4p, 1 Black and White Photograph, 5 Graphs
Autor:
Min, Ji Hyun, An, Boo Hyun, Cho, Ji Ung, Ji, Hye Min, Noh, Su Jung, Kim, Young Keun, Liu, Hong Ling, Wu, Jun Hua, Ko, Young-Dong, Chung, Jin-Seok
Publikováno v:
Journal of Applied Physics; 5/1/2007, Vol. 101 Issue 9, p09K513, 3p, 3 Graphs
Publikováno v:
Journal of The Electrochemical Society; 2017, Vol. 164 Issue 2, pD30-D38, 9p
Publikováno v:
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators & Microsystems (TRANSDUCERS); 2015, p596-601, 6p