Zobrazeno 1 - 6
of 6
pro vyhledávání: '"T. Remmell"'
Autor:
M. Raymond, T. Remmell, E. D. Luckowski, S. Braithwaite, D. Roberts, J. Walls, D. Qualls, Melvy F. Miller, M. Martin, Rampi Ramprasad
Publikováno v:
2004 IEEE International Reliability Physics Symposium. Proceedings.
TDDB testing of MIM capacitors with various thickness plasma silicon nitride dielectric yielded high quality lifetime data, with very large Weibull betas and consistency between wafer-scale and package level tests. An excellent fit of the data to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::853b75e66fd3293dd3446d4a23d29a13
https://doi.org/10.1109/relphy.2004.1315395
https://doi.org/10.1109/relphy.2004.1315395
Autor:
Zibar, Wafaa, Richard, Olivier, Drighil, Asmaa, Lachhab, Touria, Mziouek, Hasna, Aimez, Vincent, Jaouad, Abdelatif, Adhiri, Rhma
Publikováno v:
European Physical Journal - Applied Physics; 2022, Vol. 97, p1-9, 9p
Conference
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Autor:
Vincent Terrace
This fully updated and expanded edition covers over 10,200 programs, making it the most comprehensive documentation of television programs ever published. In addition to covering the standard network and cable entertainment genres, the book also cove
Autor:
Steinbruchel, Christoph
Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the
Autor:
Hopwood, Jeffrey A.
This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because convention