Zobrazeno 1 - 4
of 4
pro vyhledávání: '"T. Massingill"'
Autor:
T. Massingill, Y. Takahashi, Hunt Jiang, M. Lee, S. Beilin, J. Roman, D. Kudzuma, Bill Chou, V. Wang, M. McCormack, M. Peters
Publikováno v:
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
The industrial trend of shrinking microelectronic devices while increasing the density of interconnections places great demands on the substrates upon which these devices are packaged. Multilayer flex circuits will provide the interconnection densiti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcc8a81377cea6545aaf73b4241be399
https://doi.org/10.1109/ectc.1999.776353
https://doi.org/10.1109/ectc.1999.776353
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
Ball Grid Array (BGA) packages have been gaining popularity due to the increasing demand for greater interconnect density. For high I/O applications, plastic BGA (PBGA) and tape BGA (TBGA) are attractive alternatives to fine-pitch quad flat pack and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6184521d20608043f98c27d0c589b37a
https://doi.org/10.1109/ectc.1996.550504
https://doi.org/10.1109/ectc.1996.550504
Publikováno v:
MRS Proceedings. 203
The lifetime of non-compliant eutectic solder joints was improved by an order magnitude by rapid quenching. The quenching produces a fine equiaxed superplastic grain structure which lowers the stresses in the solder joints for the fatigue cycle strai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e57ba4ce62ea138bb73f91537775db5
https://doi.org/10.1557/proc-203-425
https://doi.org/10.1557/proc-203-425
Conference
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