Zobrazeno 1 - 10
of 31
pro vyhledávání: '"T. L. Alford"'
Autor:
Dahiru M. Sanni, Yuanqing Chen, Aditya S. Yerramilli, Esidor Ntsoenzok, Joseph Asare, Sharafadeen A. Adeniji, Omolara V. Oyelade, Adebayo A. Fashina, T. L. Alford
Publikováno v:
Materials for Renewable and Sustainable Energy, Vol 8, Iss 1, Pp 1-10 (2018)
Abstract In this study, we reported a low-temperature, one-step solution process to fabricate perovskite solar cells using dehydrated lead acetate as the lead source. These perovskite films were aged at 200 s before thermal annealing at 90 °C for 5
Externí odkaz:
https://doaj.org/article/e761319fdf06479ebe73b2ff59977164
Autor:
Aritra Dhar, T. L. Alford
Publikováno v:
APL Materials, Vol 1, Iss 1, Pp 012102-012102-7 (2013)
Multilayer structures of TiO2/Ag/TiO2 have been deposited onto flexible substrates by room temperature sputtering to develop indium-free transparent composite electrodes. The effect of Ag thicknesses on optical and electrical properties and the mecha
Externí odkaz:
https://doaj.org/article/e8755e762a6d496e99a6d1ccb76af085
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:21161-21171
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b4eac2ab4857f3e4f6fa695b165c467
https://doi.org/10.1007/s10854-022-08922-2
https://doi.org/10.1007/s10854-022-08922-2
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:4415-4425
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5976b209b0c066421df881ff4e17a73
https://doi.org/10.1007/s10854-021-07633-4
https://doi.org/10.1007/s10854-021-07633-4
Publikováno v:
Journal of Applied Physics. 81:7773-7777
The texture of evaporated Ag films prepared on Ti or Cr underlayers before and after encapsulation process has been studied by x-ray diffraction. In addition, the stress state in self-encapsulated Ag/Ti structures has also been investigated using a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64e42fda0ad02d193f956e8e9bda9180
https://doi.org/10.1063/1.365386
https://doi.org/10.1063/1.365386
Publikováno v:
Journal of The Electrochemical Society. 143:2349-2353
Cu{sub 74}Ti{sub 26} alloy films were annealed in flowing NH{sub 3} at temperatures of 450 to 700 C. Ti segregates to the free surface to form TiN, leaving nearly pure Cu in the remaining metal film. Elastic recoil detection and Auger electron spectr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78a12b02a06fc3683f1e66f29e1504f7
https://doi.org/10.1149/1.1837005
https://doi.org/10.1149/1.1837005
Publikováno v:
Journal of The Electrochemical Society. 142:1308-1317
We study the dealloying of Ti from Cu 1-x Ti x (x∼10 atom percent) alloy films on oxidized Si substrates in the temperature range of 375 to 490 o C and an estimated O 2 partial pressure of ∼10 -6 to 10 -5 Torr. Reaction products were determined t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2153b68aac0d7407c1707449e5a5994
https://doi.org/10.1149/1.2044169
https://doi.org/10.1149/1.2044169
Publikováno v:
ChemInform. 27
Cu{sub 74}Ti{sub 26} alloy films were annealed in flowing NH{sub 3} at temperatures of 450 to 700 C. Ti segregates to the free surface to form TiN, leaving nearly pure Cu in the remaining metal film. Elastic recoil detection and Auger electron spectr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da057ef38c3a68b87dd8bdfa3f15ffe4
https://doi.org/10.1002/chin.199646288
https://doi.org/10.1002/chin.199646288