Zobrazeno 1 - 10
of 38
pro vyhledávání: '"T. J. Broomhall"'
Publikováno v:
Frontiers in Bioengineering and Biotechnology, Vol 10 (2022)
Despite the high incidence of tendon injuries worldwide, an optimal treatment strategy has yet to be defined. A key challenge for tendon repair is the alignment of the repaired matrix into orientations which provide maximal mechanical strength. Using
Externí odkaz:
https://doaj.org/article/ae5cf4fe91e04b0eb75364a7ad106835
Autor:
K. Dhillon, K. Aizel, T. J. Broomhall, E. Secret, T. Goodman, M. Rotherham, N. Telling, J. M. Siaugue, C. Ménager, J. Fresnais, M. Coppey, A. J. El Haj, M. A. Gates
Publikováno v:
Journal of The Royal Society Interface. 19
A challenge in current stem cell therapies for Parkinson's disease (PD) is controlling neuronal outgrowth from the substantia nigra towards the targeted area where connectivity is required in the striatum. Here we present progress towards controlling
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2418115e8b9ce2222d806f9b334ba24e
https://doi.org/10.1098/rsif.2022.0576
https://doi.org/10.1098/rsif.2022.0576
Autor:
T. J. Broomhall, T. J. Hayward
Publikováno v:
Scientific Reports, Vol 7, Iss 1, Pp 1-12 (2017)
Finite temperature micromagnetic simulations were used to investigate the magnetisation structure, propagation dynamics and stochastic pinning of domain walls in rare earth-doped Ni80Fe20 nanowires. We first show how the increase of the Gilbert dampi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::3d915fdef58d4cd4cd5029dcc5c8710d
https://eprints.whiterose.ac.uk/125095/1/s41598-017-17097-4.pdf
https://eprints.whiterose.ac.uk/125095/1/s41598-017-17097-4.pdf
Autor:
Ščepka, Tomáš, Feilhauer, Juraj, Tóbik, Jaroslav, Krylov, Sergei, Kalmykova, Tetiana, Cambel, Vladimír, Mruczkiewicz, Michal
Publikováno v:
Journal of Applied Physics; 12/7/2023, Vol. 134 Issue 21, p1-6, 6p
Autor:
Perez, Jose E.1 (AUTHOR), Jan, Audric2 (AUTHOR), Villard, Catherine1,3 (AUTHOR), Wilhelm, Claire1 (AUTHOR) claire.wilhelm@cnrs.fr
Publikováno v:
Advanced Science. Sep2023, Vol. 10 Issue 27, p1-12. 12p.
Autor:
Bittencourt, Guilherme H. R., Castro, Mario, Nunez, Alvaro S., Altbir, Dora, Allende, Sebastian, Carvalho-Santos, Vagson L.
Publikováno v:
Nanoscale; 9/28/2024, Vol. 16 Issue 36, p16844-16851, 8p
Autor:
Kim, Hyun‐Joong, Moon, Kyoung‐Woong, Yoon, Seongsoo, An, Kyongmo, Kim, Changsoo, Yang, Seungmo, Ju, Tae‐Seong, Son, Jong Wan, Hong, Jung‐Il, Hwang, Chanyong
Publikováno v:
Advanced Electronic Materials; Sep2024, Vol. 10 Issue 9, p1-9, 9p
Autor:
Shim SK; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Lee K; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Han J; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Shin DH; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Lee SH; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Cheong S; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Jang YH; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Hwang CS; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Dec; Vol. 36 (50), pp. e2410432. Date of Electronic Publication: 2024 Sep 30.
Autor:
Wan C; Yongjiang Laboratory (Y-LAB), Ningbo, Zhejiang, 315202, China.; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.; Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China., Pei M; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China., Shi K; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China., Cui H; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China., Long H; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China., Qiao L; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China., Xing Q; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China., Wan Q; Yongjiang Laboratory (Y-LAB), Ningbo, Zhejiang, 315202, China.; School of Electronic Science and Engineering, National Laboratory of Solid-State Microstructures, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.; Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Sep; Vol. 36 (37), pp. e2311288. Date of Electronic Publication: 2024 Feb 21.
Publikováno v:
Journal of Applied Physics; 11/7/2020, Vol. 128 Issue 17, p1-42, 42p