Zobrazeno 1 - 3
of 3
pro vyhledávání: '"T. I. Shih"'
Publikováno v:
JOM. 59:32-37
In this study, electrical characterization for lead-free materials in bump technology was developed and joint assemblies were thermally treated under temperature cycling tests. Measurements of sheet resistivity and contact resistance of intermetallic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4bcddfa792ad81bb65a0c425249efd2c
https://doi.org/10.1007/s11837-007-0086-4
https://doi.org/10.1007/s11837-007-0086-4
Autor:
Tung Hung Chen, T. I. Shih
Publikováno v:
International Symposium for Testing and Failure Analysis.
Thermal fatigue cracking of lead-free solder joints within flipchip packages was investigated in this study by using scanning acoustic microscope (SAM) and SEM. The distribution of substrate delaminations was mapped with SAM of high depth resolution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52336f2c7e21979a48c9bface8cada8d
https://doi.org/10.31399/asm.cp.istfa2006p0228
https://doi.org/10.31399/asm.cp.istfa2006p0228
Autor:
T. I. Shih, Tung Hung Chen
Publikováno v:
International Symposium for Testing and Failure Analysis.
In order to do the failure analysis on flip chip connected with ceramic substrate, solder bump should be completely removed from chip surface. The die soldered on ceramic substrate of flip chip package is likely damaged during the removing process fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ace59fa6f4e49ede6163c349dd9380ea
https://doi.org/10.31399/asm.cp.istfa2006p0214
https://doi.org/10.31399/asm.cp.istfa2006p0214