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pro vyhledávání: '"T. Hasegawa M. Oie"'
Autor:
Steven Consiglio, Fumitaka Amano, Kaoru Maekawa, C. S. Wajda, Kai-Hung Yu, Gerrit J. Leusink, T. Hasegawa M. Oie
Publikováno v:
IEEE International Interconnect Technology Conference.
Cu-fill extendability is demonstrated with a novel integration scheme using clustered ALD barrier, CVD Ru liner and PVD Cu dry-fill processes.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::094a5ba0fb463c30a143347a4fef185c
https://doi.org/10.1109/iitc.2014.6831857
https://doi.org/10.1109/iitc.2014.6831857
