Zobrazeno 1 - 10
of 21
pro vyhledávání: '"T. C. Cucu"'
Publikováno v:
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME).
Under the current conditions of reducing manufacturing costs and complying with the RoHS 2 EU Recast Directive in the automotive industry, without compromising functionality and reliability, it has become necessary to create a new Lead-Free Solder Pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e70c4a0b5d008385190bb2b9db203ec2
https://doi.org/10.1109/siitme.2017.8259861
https://doi.org/10.1109/siitme.2017.8259861
Comparative shear tests of two low melting point solder pastes relating to their thermal diffusivity
Publikováno v:
2017 40th International Spring Seminar on Electronics Technology (ISSE).
In a vehicle, for electronic components, the working temperature may vary between the limits 358K and 478K. The manufacturing costs reduction necessity combined with the RoHS2 EU Directive consequence lead to create new Low Melting Point Lead-Free (L
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78c75a8d5888461d90a9d91a6af4a3c6
https://doi.org/10.1109/isse.2017.8000937
https://doi.org/10.1109/isse.2017.8000937
Publikováno v:
SPIE Proceedings.
The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K 1 . The so
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8408e1625afe4b2d644a86acee8177b
https://doi.org/10.1117/12.2246106
https://doi.org/10.1117/12.2246106
Publikováno v:
2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME).
The maximum temperature of all parts of automotive electronics equipment is given by the location and can vary between 358 K and 478 K. RoHS EU Directive in the context of the manufacturing costs reduction, necessity led automotive industry to create
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74da238d395dffdd41fea4721323cc52
https://doi.org/10.1109/siitme.2016.7777240
https://doi.org/10.1109/siitme.2016.7777240
Publikováno v:
2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3cb3490d0c82ab983650eafcbe39590f
https://doi.org/10.1109/siitme.2014.6966995
https://doi.org/10.1109/siitme.2014.6966995
Autor:
Bogdan Mihailescu, T. C. Cucu, Andreas Thumm, Mihai Branzei, Andreas Flechtmann, Ioan Plotog, Mihai Tarcolea, Paul Svasta, Florin Miculescu
Publikováno v:
2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The challenges for the companies involved in conception, development and/or manufacturing of electronic products are the lead-free technology with its increased melting temperature of the solder alloy and trend to reduce the solder materials cost by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::534bb3367bfbdff3990a77a1f2a22ef6
https://doi.org/10.1109/siitme.2011.6102710
https://doi.org/10.1109/siitme.2011.6102710
Autor:
Mihai Branzei, T. C. Cucu, Mihai Tarcolea, Paul Svasta, Ioan Plotog, Bogdan Mihailescu, Ioan Pencea
Publikováno v:
Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE).
In the case of surface mount technology (SMT), the 4P Soldering Process [1, 2, 3] concept defines solder joints as result of synergistic interactions and of correlation of Pad-Paste-Pin-Process considered as Key Process Input Variables (KPIV). As con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07c264e605417d0399ef69218eb81ff0
https://doi.org/10.1109/isse.2011.6053881
https://doi.org/10.1109/isse.2011.6053881
Publikováno v:
2010 9th International Symposium on Electronics and Telecommunications.
The increasing demand for high integration with continuous decreasing dimensions, maintaining quality and low cost for electronic modules brought on the market new types of printed circuits boards (PCBs), having different material core as substrate.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0167c1d5a9b0f3b7e8ba8e4c93da5af
https://doi.org/10.1109/isetc.2010.5679346
https://doi.org/10.1109/isetc.2010.5679346
Autor:
Iulian Busu, Radu Bunea, Bogdan Mihailescu, Ioan Plotog, Gaudentiu Varzaru, T. C. Cucu, Paul Svasta
Publikováno v:
2010 9th International Symposium on Electronics and Telecommunications.
The assembling of the electronic components on PCBs becomes a key issue in electronic packaging reliability. The solder joints resulting from the soldering process represent an important outcome for the PCB assembling. Moreover, the Lead-Free solderi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b858ef6f4ba8f12ef7463f744b1bed9
https://doi.org/10.1109/isetc.2010.5679337
https://doi.org/10.1109/isetc.2010.5679337
Publikováno v:
2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME).
As elements of interconnection structures at level two in electronic packaging, the pads could be considered as a particular solution into a virtual space defined by the materials, geometry, surface finishes and substrate [1, 2]. The assembling proce
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21577dd735ac51f148726728a07f2e14
https://doi.org/10.1109/siitme.2010.5651792
https://doi.org/10.1109/siitme.2010.5651792