Zobrazeno 1 - 10
of 145
pro vyhledávání: '"T, Fritzsch"'
Autor:
F. Huegging, T. Fritzsch
Within WP6 (Hybrid Pixel Sensors for 4D Tracking and Interconnection Technologies) Milestone MS25 contains the availability of parts and definition of technologies for wafer-to-wafer hybridization. This milestone has been successfully achieved and is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::46349456f1d97d95cd1a444b0f76801e
Autor:
T. Fritzsch, F. Huegging, P. Mackowiak, K. Zoschke, M. Rothermund, N. Owtscharenko, D.-L. Pohl, H. Oppermann, N. Wermes
The through silicon via (TSV) technology has been introduced in a wide range of electronic packaging applications. Hybrid pixel detectors for X-ray imaging and for high-energy physics (HEP) can benefit from this technology as well. A 3D TSV prototype
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6209f0ed21f2a31eb9dbfbb0691acdd6
https://publica.fraunhofer.de/handle/publica/434379
https://publica.fraunhofer.de/handle/publica/434379
Autor:
Martin Schneider-Ramelow, Hans Walter, T. Fritzsch, Aleksander Keller, Astrid Gollhardt, Markus Woehrmann, Klaus-Dieter Lang, Michael Schiffer
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Fan-Out enables new heterogeneous packaging concepts where chips are embedded in an electronic mold compound (EMC) package with ultra-small footprint. These multi-chip systems demand a high routing density in the redistribution layer (RDL) which is r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::454d0f7b138ec38d3e1e181b8a4e575d
https://doi.org/10.1109/ectc32862.2020.00146
https://doi.org/10.1109/ectc32862.2020.00146
Publikováno v:
2019 12th German Microwave Conference (GeMiC).
With increasing demand for miniaturization the requirements for packaging and system integration are more challenging especially when more and more components are to be integrated into a compact module. In such a situation, crosstalk effects and sign
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d346a40ca79b7ff5a5d23cc44053084
https://doi.org/10.23919/gemic.2019.8698163
https://doi.org/10.23919/gemic.2019.8698163
Autor:
Fabian Hügging, T. Fritzsch, Piotr Mackowiak, H. Oppermann, Norbert Wermes, N. Owtscharenko, D. Pohl, M. Rothermund, K. Zoschke, O. Ehrmann
The through-silicon via (TSV) technology offers high-density vertical stacking of integrated circuits , providing a smaller and simpler structure, whilst increasing connectivity and performance. In High-Energy Physics (HEP) experiments, via-last TSVs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::35b2f4ba4c71c1bf8911763878c4eebd
https://publica.fraunhofer.de/handle/publica/254697
https://publica.fraunhofer.de/handle/publica/254697
Publikováno v:
2017 47th European Microwave Conference (EuMC).
On-wafer measurements of any Device Under Test (DUT) usually require the application of a calibration algorithm to eliminate unwanted but unavoidable effects due to the probe tip properties, the probe pad, the neighboring structures on the wafer and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b748de7b7b17632df021a8247de5c8b2
https://doi.org/10.23919/eumc.2017.8230974
https://doi.org/10.23919/eumc.2017.8230974
Autor:
Piotr Maj, Robert Szczygiel, Klaus-Dieter Lang, Hermann Opperman, Mario Rothermund, Kai Zoschke, Ulf Oestermann, Steve Voges, Pawel Grybos, T. Fritzsch, Krzysztof Kasinski
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
In this article we present the conception, technological fabrication and electrical characterization of 3D hybrid pixel detector modules based on read out chips (ROCs) with through silicon vias (TSVs) which are flip chip bonded onto silicon photon se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49fc6a63037e66ada8fad83a6d83e26a
https://doi.org/10.1109/ectc.2017.278
https://doi.org/10.1109/ectc.2017.278
Autor:
Robert Gideon Wodnicki, Rayette Ann Fisher, B. Bonitz, B. Otto, Xuefeng Zhuang, Pierre Khuri-Yakub, M. Topper, O. Ehrmann, T. Fritzsch, Kai Erik Thomenius, William Edward Burdick, Der-Song Lin, David M. Mills, Charles Gerard Woychik, T. Davies, A. J. Byun, G. Thomas
Publikováno v:
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control. 60:1356-1375
A promising transducer architecture for largearea arrays employs 2-D capacitive micromachined ultrasound transducer (CMUT) devices with backside trench-frame pillar interconnects. Reconfigurable array (RA) application-specified integrated circuits (A
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5ae6a35e639aba843822ca3b4e73e1fd
https://doi.org/10.1109/tuffc.2013.2709
https://doi.org/10.1109/tuffc.2013.2709
Autor:
David Pennicard, M. Zuvic, T. Fritzsch, B. Struth, M. Sarajlic, S. Smoljanin, M. Askar, M. O. Lampert, M. Rothermund, Helmut Hirsemann, Heinz Graafsma
Publikováno v:
Journal of Instrumentation 12(01), C01068 (2017). doi:10.1088/1748-0221/12/01/C01068
18th International Workshop on Radiation Imaging Detectors (IWORID2016), Barcelona, Spain, 2016-07-03-2016-07-07
18th International Workshop on Radiation Imaging Detectors (IWORID2016), Barcelona, Spain, 2016-07-03-2016-07-07
18th International Workshop on Radiation Imaging Detectors (IWORID2016), Barcelona, Spain, 3 Jul 2016 - 7 Jul 2016 ; Journal of Instrumentation 12(01), C01068(2017). doi:10.1088/1748-0221/12/01/C01068
Here we present new result on the testing of
Here we present new result on the testing of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2420ce485fdbf26de61502a6fbde3e2c
https://publica.fraunhofer.de/handle/publica/251701
https://publica.fraunhofer.de/handle/publica/251701
Autor:
G. Engelmann, M. Klein, M. J. Wolf, Lothar Dietrich, B. Bramer, T. Fritzsch, Hermann Oppermann, R Dudek, Matthias Hutter, Herbert Reichl
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:359-366
Lead-free reflow soldering techniques applying AuSn as well as SnAg electroplated bumps were chosen for the evaluation of the flip-chip-bonding process for X-ray pixel detectors. Both solders can be used in pick-and-place processes with a subsequent
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::128032eb19d4b14d87dbe6a0a4ad41ab
https://doi.org/10.1109/tcpmt.2011.2108299
https://doi.org/10.1109/tcpmt.2011.2108299