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pro vyhledávání: '"Szu Shing Lim"'
Autor:
Ai Lin Ong, Szu Shing Lim, Hwa Wei Chan, Choong Kooi Chee, E. Then, Shanggar Periaman, V.A. Rudge
Publikováno v:
53rd Electronic Components and Technology Conference, 2003. Proceedings..
This paper focuses on the molded underfill (MUF) technology for exposed die flip chip in the form of a molded matrix array package (FC-MMAP). Exposed die FC-MMAP in a strip form was built by placing a layer of compressible film between the die and mo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ff2620f16c68da78dbb0e343e7997be
https://doi.org/10.1109/ectc.2003.1216407
https://doi.org/10.1109/ectc.2003.1216407
Autor:
Choong Kooi Chee, Szu Shing Lim, Rudge, V.A., Periaman, S., Ai Lin Ong, Hwa Wei Chan, Then, E.
Publikováno v:
Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p962-970, 9p