Zobrazeno 1 - 10
of 180
pro vyhledávání: '"Szendiuch, I."'
Autor:
Hurban, M., Szendiuch, I.
Pájení přetavením je v současné době nejvíce používanou metodou spojování součástek do elektronických sestav. Vlastní pájení dnes probíhá při teplotách kolem 235 - 245°C, což klade významné požadavky na účinnost přenosu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______8936::38dc130351b077fc2507905c5660c891
http://hdl.handle.net/11025/47219
http://hdl.handle.net/11025/47219
Autor:
Hurban, M., Szendiuch, I.
Production of electronics gets more and more complex every day. This situation requires all possible information about the production process. Not only information about the components, but also about the machines and their status. New industrial rev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______8936::755265be30d29e6cae476e9a5aebe700
http://hdl.handle.net/11025/36526
http://hdl.handle.net/11025/36526
Autor:
Hurban, M., Szendiuch, I.
In this article you will find description of new technological tools for more effective, more accurate and cheaper production of electronic assemblies. Main focus is on to soldering technology. Nowadays, there's a strong focus on digitalization and a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______8936::a27f246e1bffcc9c5bcdcc2a808c3127
http://hdl.handle.net/11025/31004
http://hdl.handle.net/11025/31004
Autor:
Szendiuch, I.
Publikováno v:
Radioengineering, Vol 20, Iss 1, Pp 214-220 (2011)
Radioengineering. 2011, vol. 20, č. 1, s. 214-220. ISSN 1210-2512
Radioengineering. 2011, vol. 20, č. 1, s. 214-220. ISSN 1210-2512
The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must realize the require
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::a8d2853a3db2075fb738e83487b80c23
http://www.radioeng.cz/fulltexts/2011/11_01_214_220.pdf
http://www.radioeng.cz/fulltexts/2011/11_01_214_220.pdf
Autor:
Pulec, J., Szendiuch, I.
This paper deals with thick film pl anar microstrip edge coupled frequency filter design and realization, where the third order, chebyshev based design is considered. The realization then considers various apllication material and substrate thickness
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______8936::7c72082136e3536d248b7a36ca80ccf2
http://hdl.handle.net/11025/22032
http://hdl.handle.net/11025/22032
Publikováno v:
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology; 2014, p198-201, 4p
Publikováno v:
Proceedings of the 36th International Spring Seminar on Electronics Technology; 2013, p7-10, 4p
Publikováno v:
2013 European Microelectronics Packaging Conference (EMPC); 2013, p1-5, 5p
Publikováno v:
18th European Microelectronics & Packaging Conference; 1/ 1/2011, p1-4, 4p
Publikováno v:
18th European Microelectronics & Packaging Conference; 1/ 1/2011, p1-5, 5p